Datasheet > BZT52C9V1L3PHE3

BZT52C9V1L3PHE3

更新时间： 2024-11-15 17:00:07

品牌	Logo	应用领域
美微科 - MCC		/
页数	文件大小	规格书
4页	2506K
描述
Tape&Reel: 10Kpcs/Reel;

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数据手册

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BZT52C9V1L3PHE3 数据手册

BZT52C2V4L3PHE3 THRU BZT52C39L3PHE3

Features

•

Ideally Suited fou Automated Assembly Processes

Halogen Free. “Green” Device (Note 1)

Moisture Sensitivity Level 1

150 mW

Zener Diode

2.4 to 47 Volts

Epoxy Meets UL 94 V-0 Flammability Rating

Lead Free Finish/RoHS Compliant ("P" Suffix Designates RoHS

Compliant. See Ordering Information)

AEC-Q101 Qualified

•

Maximum Ratings

•

Operating Junction Temperature Range: -55°C to +150°C

Storage Temperature Range: -55°C to +150°C

DFN1006-2L

Thermal Resistance(Note2) : 833°C/W Junction to Ambient

Cathode Band

Symbol

Parameter

Rating

Conditions

P_D

Power Dissipation

150mW

Maximum Forward

Voltage

I_F=10mA

V_F

0.9V

Note:1. Halogen free "Green” products are defined as those which contain <900ppm bromine,

Anode

<900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.

2. Part mounted on FR-4 board with recommended pad layout.

Internal Structure and Marking Code

DIMENSIONS

INCHES

DIM

NOTE

MIN MAX MIN MAX

0.037 0.041 0.95 1.05

0.022 0.026 0.55 0.65

0.016 0.020 0.40 0.50

----- 0.002 ----- 0.05

0.001 0.003 0.02 0.08

Cathode

Anode

0.026BSC

0.65BSC

0.008 0.012 0.20 0.30

0.018 0.022 0.45 0.55

Suggested Solder Pad Layout

(mm)

╋

0.5

1.3

0.8

0.3

╋

0.6

Rev.4-1-09182023

1/4

MCCSEMI.COM

12 3 4

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