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BZT52C9V1 PDF预览

BZT52C9V1

更新时间: 2024-12-02 14:47:47
品牌 Logo 应用领域
鲁光 - LGE 稳压二极管
页数 文件大小 规格书
3页 1679K
描述
稳压二极管

BZT52C9V1 数据手册

 浏览型号BZT52C9V1的Datasheet PDF文件第2页浏览型号BZT52C9V1的Datasheet PDF文件第3页 
BZT52C2V0-BZT52C51  
Surface Mount Zener Diodes  
SOD-123  
0.022(0.55)  
Typ. Min.  
0.053(1.35)  
Max.  
Features  
0.152(3.85)  
0.140(3.55)  
0.112(2.85)  
0.100(2.55)  
z
Planar die construction.  
500mW power dissipation on ceramic  
PCB.  
z
0.010(0.25)  
Min.  
0.067(1.70)  
0.055(1.40)  
z
z
General purpose, medium current.  
0.006(0.15)  
Typ. Min.  
Ideally suited for automated assembly processes.  
0.004(0.10)  
Max.  
Applications  
Dimensions in inches and (millimeters)  
z
z
Zener diode.  
Ultra-small surface mount package.  
Ordering Information  
Type No.  
Marking  
Package Code  
SOD-123  
BZT52C2V4-BZT52C51  
See table 2  
MAXIMUM RATING @ Ta=25unless otherwise specified  
Characteristic  
Symbol  
Value  
Unit  
V
Forward Voltage  
@ IF=10mA  
VF  
0.9  
Power Dissipation  
Pd  
500  
mW  
/W  
Thermal resistance,junction to ambient air  
Junction temperature  
RθjA  
305  
Tj  
150  
Storage temperature range  
Tstg  
-65-150  
Notes: 1. Device mounted on ceramic PCB; 7.6mm x 9.4mm x 0.87mm with pad areas 25mm2  
2. Short duration test pulse used to minimize self-heating effect.  
3. When provided, otherwise, parts are provided with date code only, and type number  
identifications appears on reel only.  
4. f = 1KHz  
http://www.lgesemi.com  
mail:lge@lgesemi.com  
Revision:20170701-P1  

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