BZT52C6V8T-TP-HF

更新时间： 2024-11-20 13:06:03

品牌	Logo	应用领域
美微科 - MCC		稳压二极管齐纳二极管
页数	文件大小	规格书
3页	200K
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中文翻译

获取价格

数据手册

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BZT52C6V8T-TP-HF 数据手册

M C C

Micro Commercial Components

ꢀꢁꢂꢃꢄꢅꢆꢄꢇꢇꢈꢃꢂꢁꢉꢊꢅꢆomponents

20736 Marilla Street Chatsworth

ꢆꢋꢅꢌꢍꢎꢍꢍ

ꢏꢐꢄꢑꢈꢒꢅꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢎ

$ꢉ%ꢒꢅ ꢅ ꢅ ꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢌ

BZT52C2V4

THRU

BZT52C43

Features

xꢀ Planar Die Construction

xꢀ 500mW Power Dissipation on Ceramic PCB

xꢀ General Purpose Medium Current

xꢀ Ideally Suited for Automated Assembly Processes

500 mW

Zener Diode

2.4 to 43 Volts

Case Material: Molded Plastic. UL Flammability

Classification Rating 94V-0 and MSL Rating 1

Lead Free Finish/RoHS Compliant("P" Suffix

•

designates RoHS Compliant. See ordering information)

SOD123

Absolute Maximum Ratings

Symbol

Rating

500

Unit

P_D

Power dissipation

T_J

Junction Temperature

-65 to +150

T_STG

Storage Temperature Range

Absolute Maximum Ratings

Symbol

DIMENSIONS

DIM

INCHES

MIN

NOTE

Rating

Unit

MAX

.152

.112

.071

.053

.031

-----

.01

MIN

3.55

2.55

1.40

-----

0.30

0.15

-----

MAX

3.85

2.85

1.80

1.35

.78

Thermal Resistance Junction to

Ambient*

.140

.100

.055

-----

.012

.006

-----

к/W

R_thJA

250

* Device mounted on ceramic PCB: 7.6mm x 9.4mm x 0.87mm with

pad areas 25 mm²

-----

.25

Electrical Characteristics

.006

.15

Symbol

Rating

Unit

SUGGESTED SOLDER

PAD LAYOUT

Maximum Forward Voltage

(I_F=10mAdc)

V_F

0.9

0.093"

0.048”

0.036”

www.mccsemi.com

1 of 3

Revision: 10

2010/03/01

12 3

中文翻译

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