Datasheet > BZT52C5V6S

BZT52C5V6S

更新时间： 2024-02-26 00:27:04

品牌	Logo	应用领域
TYSEMI		二极管测试光电二极管
页数	文件大小	规格书
2页	102K
描述
Planar Die Construction Ultra-Small Surface Mount Package

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中文翻译

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BZT52C5V6S 技术参数

Product specification

BZT52C2V0S - BZT52C39S

Features

Planar Die Construction

Ultra-Small Surface Mount Package

Ideally Suited for Automated Assembly Processes

Absolute Maximum Ratings (Ta = 25

)

Parameter

Power dissipation

Symbol

Rating

200

Unit

Thermal Resistance, Junction to Ambient Air

625

Forward Voltage

@ I^F= 10mA

V^F

0.9

Jumction temperature

Storage temperature

T^j

150

T^stg

-65 to +150

http://www.twtysemi.com

sales@twtysemi.com

4008-318-123

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