BZT52C47S

更新时间： 2023-11-02 19:30:24

品牌	Logo	应用领域
美微科 - MCC		/
页数	文件大小	规格书
4页	411K
描述
Tape&Reel: 3Kpcs/Reel;

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数据手册

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BZT52C47S 数据手册

BZT52C2V4S

THRU

BZT52C39S

M C C

ꢀꢁꢂꢃꢄꢅꢆꢄꢇꢇꢈꢃꢂꢁꢉꢊꢅꢆomponents

21201 Itasca Street Chatsworth

ꢆꢋꢅꢌꢍꢎꢍꢍ

ꢏꢐꢄꢑꢈꢒꢅꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢎ

$ꢉ%ꢒꢅ ꢅ ꢅ ꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢌ

Features

200 mW

Planar Die construction

200mW Power Dissipation

Zener Voltages from 2.4V - 39V

Zener Diodes

2.4 to 39 Volts

Ideally Suited for Automated Assembly Processes

Mechanical Data

SOD323

Case: SOD-323 Molded Plastic

Terminals: Solderable per MIL-STD-202, Method 208

Approx. Weight: 0.008 gram

Mounting Position: Any

Storage & Operating Junction Temperature: -55^oC to +150^oC

Maximum Ratings @ 25^oC Unless Otherwise Specified

Zener Current

Maximum Forward

Voltage

I_F

V_F

100

1.2

Power Dissipation

(Notes A)

Peak Forward Surge

Current (Notes B)

P_(AV)

200

2.0

mWatt

Amps

IFSM

NOTES:

DIMENSIONS

A. Mountedon5.0mm2(.013mmthick)landareas.

B. Measured on 8.3ms, single half sine-wave or equivalent

squarewave, dutycycle=4pulsesperminutemaximum.

DIM

INCHES

MIN

NOTE

MAX

.107

.078

.054

.038

.014

.006

---

MIN

2.30

1.75

1.15

0.70

0.25

0.05

0.30

MA X

2.70

1.95

1.35

0.95

0.35

0.15

---

.090

.068

.045

.027

.009

.002

.012

SUGGESTED SOLDER

PAD LAYOUT

0.059"

0.039”

0.031”

www.mccsemi.com

12 3 4

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