Datasheet > BZT52C2V0_08

BZT52C2V0_08

更新时间： 2022-10-18 15:22:07

品牌	Logo	应用领域
美台 - DIODES		稳压二极管
页数	文件大小	规格书
4页	165K
描述
SURFACE MOUNT ZENER DIODE

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中文翻译

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BZT52C2V0_08 数据手册

BZT52C2V0 - BZT52C39

SURFACE MOUNT ZENER DIODE

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Features

Mechanical Data

•

Planar Die Construction

500mW Power Dissipation on Ceramic PCB

General Purpose, Medium Current

Ideally Suited for Automated Assembly Processes

Lead, Halogen and Antimony Free, RoHS Compliant

"Green" Device (Notes 2 and 3)

•

Case: SOD-123

Case Material: Molded Plastic. UL Flammability Classification

Rating 94V-0

Moisture Sensitivity: Level 1 per J-STD-020D

Terminals: Solderable per MIL-STD-202, Method 208

Lead Free Plating (Matte Tin Finish annealed over Alloy 42

leadframe)

Polarity: Cathode Band

Marking Information: See Page 3

Ordering Information: See Page 3

Weight: 0.010 grams (approximate)

•

Qualified to AEC-Q101 Standards for High Reliability

•

Top View

Maximum Ratings @T_A= 25°C unless otherwise specified

Single phase, half wave, 60Hz, resistive or inductive load.

For capacitance load, derate current by 20%.

Characteristic

Symbol

Value

Unit

0.9

Forward Voltage

@ I_F= 10mA

V_F

Thermal Characteristics

Characteristic

Power Dissipation (Note 1)

Symbol

Value

500

Unit

P_D

Thermal Resistance, Junction to Ambient Air (Note 1)

Operating and Storage Temperature Range

250

°C/W

°C

R_θ

-65 to +150

T_J,T_STG

Notes:

1. Device mounted on ceramic PCB; 7.6mm x 9.4mm x 0.87mm with pad areas 25mm².

2. No purposefully added lead. Halogen and Antimony Free.

3. Product manufactured with Data Code V9 (week 33, 2008) and newer are built with Green Molding Compound. Product manufactured prior to Date

Code V9 are built with Non-Green Molding Compound and may contain Halogens or Sb₂O₃Fire Retardants.

1 of 4

www.diodes.com

June 2008

BZT52C2V0 - BZT52C39

Document number: DS18004 Rev. 32 - 2

12 3 4

中文翻译

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