BZT52C11S-T

更新时间： 2024-02-24 13:08:19

品牌	Logo	应用领域
RECTRON		二极管齐纳二极管测试
页数	文件大小	规格书
4页	210K
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BZT52C11S-T 数据手册

RECTRON

TECHNICAL SPECIFICATION

BZT52C2V4-

BZT52C39

SEMICONDUCTOR

SURFACE MOUNT ZENER DIODE

VOLTAGE RANGE 2.4 to 39 Volts POWER RATING 500 mWatts

FEATURES

* Planar Die Construction

500mW Power Dissipation on Ceramic PCB

General Purpose Medium Current

Ideally Suited for Automated Assembly Processes

SOD-123

MECHANICAL DATA

* Case: Molded plastic

.110(2.80)

.102(2.60)

* Epoxy: UL 94V-O rate flame retardant

* Lead: MIL-STD-202E method 208C guaranteed

* Mounting position: Any

.067(1.70)

.059(1.50)

* Weight: 0.01 gram

.152(3.85)

.140(3.55)

.049(1.25)

.041(1.05)

MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS

Ratings at 25 ^oC ambient temperature unless otherwise specified.

.004(.10)

.000(.00)

REF .020(0.50)

Dimensions in inches and (millimeters)

MAXIMUM RATINGES ( @ TA = 25^oC unless otherwise noted )

RATINGS

SYMBOL

VALUE

500

UNITS

Max. Steady State Power Dissipation @TA=25 C (Note 1)

Max. Operating Temperature Range

^oC

-65 to +150

Storage Temperature Range

TSTG

^oC

ELECTRICAL CHARACTERISTICS ( @ TA = 25^oC unless otherwise noted )

CHARACTERISTICS

SYMBOL

MIN.

TYP.

MAX.

305

UNITS

^oC/W

Volts

Thermal Resistance Junction to Ambient (Note 1)

Max. Instantaneous Forward Voltage at IF= 10mA

R θJA

0.9

Note 1. Device mounted on ceramic PCB; 7.6mm x 9.4mm x 0.87mm with pad areas 25mm .

2006-3

12 3 4

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