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BZT52B33JS PDF预览

BZT52B33JS

更新时间: 2024-11-03 00:37:35
品牌 Logo 应用领域
美微科 - MCC /
页数 文件大小 规格书
4页 540K
描述
200 mW Zener Diode 3.0 to 75 Volts

BZT52B33JS 数据手册

 浏览型号BZT52B33JS的Datasheet PDF文件第2页浏览型号BZT52B33JS的Datasheet PDF文件第3页浏览型号BZT52B33JS的Datasheet PDF文件第4页 
M C C  
R
Micro Commercial Components  
BZT52B3V0JS  
THRU  
ꢀꢁꢂꢃꢄꢅꢆꢄꢇꢇꢈꢃꢂꢁꢉꢊꢅꢆomponents  
20736 Marilla Street Chatsworth  
ꢆꢋꢅꢌꢍꢎꢍꢍ  
ꢏꢐꢄꢑꢈꢒꢅꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢎ  
$ꢉ%ꢒꢅ   ꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢌ  
BZT52B75JS  
Features  
xꢀ Planar Die Construction  
xꢀ 200mW Power Dissipation  
200 mW  
Zener Diode  
3.0 to 75 Volts  
xꢀ General Purpose Medium Current  
xꢀ Ideally Suited for Automated Assembly Processes  
·
·
Epoxy meets UL 94 V-0 flammability rating  
Moisture Sensitivity Level 1  
Lead Free Finish/RoHS Compliant("P" Suffix  
designates RoHS Compliant. See ordering information)  
Halogen free available upon request by adding suffix "-HF"  
SOD-323  
A
Absolute Maximum Ratings  
B
Symbol  
Parameter  
Rating  
200  
Unit  
mW  
к
PD  
Power dissipation*  
C
E
TJ  
Junction Temperature  
-55 to +150  
-55 to +150  
к
TSTG  
Storage Temperature Range  
* Mounted on 5.0mm2(.013mm thick) land areas.  
H
D
J
G
Absolute Maximum Ratings  
Symbol  
Parameter  
Rating  
Unit  
DIMENSIONS  
Thermal Resistance Junction to  
Ambient*  
DIM  
INCHES  
MIN  
MM  
NOTE  
к/W  
RthJA  
625  
MAX  
.107  
.071  
.053  
.045  
.016  
.018  
.010  
.006  
MIN  
2.30  
1.60  
1.15  
0.80  
0.25  
0.10  
0.10  
-----  
MAX  
2.70  
1.80  
1.35  
1.15  
0.40  
0.45  
0.25  
0.15  
A
B
C
D
E
G
H
J
.090  
.063  
.045  
.031  
.010  
.004  
.004  
-----  
Electrical Characteristics  
Symbol  
Parameter  
Rating  
Unit  
SUGGESTED SOLDER  
PAD LAYOUT  
Maximum Forward Voltage  
(IF=10mAdc)  
VF  
0.9  
V
0.074"  
0.027”  
0.022”  
www.mccsemi.com  
1 of 4  
2017/06/14  
Revision: F  

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