M C C
R
Micro Commercial Components
BZT52B3V0JS
THRU
ꢀꢁꢂꢃꢄꢅꢆꢄꢇꢇꢈꢃꢂꢁꢉꢊꢅꢆomponents
20736 Marilla Street Chatsworth
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ꢏꢐꢄꢑꢈꢒꢅꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢎ
$ꢉ%ꢒꢅ ꢅ ꢅ ꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢌ
BZT52B75JS
Features
xꢀ Planar Die Construction
xꢀ 200mW Power Dissipation
200 mW
Zener Diode
3.0 to 75 Volts
xꢀ General Purpose Medium Current
xꢀ Ideally Suited for Automated Assembly Processes
·
·
Epoxy meets UL 94 V-0 flammability rating
Moisture Sensitivity Level 1
•
Lead Free Finish/RoHS Compliant("P" Suffix
designates RoHS Compliant. See ordering information)
Halogen free available upon request by adding suffix "-HF"
SOD-323
•
A
Absolute Maximum Ratings
B
Symbol
Parameter
Rating
200
Unit
mW
к
PD
Power dissipation*
C
E
TJ
Junction Temperature
-55 to +150
-55 to +150
к
TSTG
Storage Temperature Range
* Mounted on 5.0mm2(.013mm thick) land areas.
H
D
J
G
Absolute Maximum Ratings
Symbol
Parameter
Rating
Unit
DIMENSIONS
Thermal Resistance Junction to
Ambient*
DIM
INCHES
MIN
MM
NOTE
к/W
RthJA
625
MAX
.107
.071
.053
.045
.016
.018
.010
.006
MIN
2.30
1.60
1.15
0.80
0.25
0.10
0.10
-----
MAX
2.70
1.80
1.35
1.15
0.40
0.45
0.25
0.15
A
B
C
D
E
G
H
J
.090
.063
.045
.031
.010
.004
.004
-----
Electrical Characteristics
Symbol
Parameter
Rating
Unit
SUGGESTED SOLDER
PAD LAYOUT
Maximum Forward Voltage
(IF=10mAdc)
VF
0.9
V
0.074"
0.027”
0.022”
www.mccsemi.com
1 of 4
2017/06/14
Revision: F