BZM55B
SERIES
SURFACE MOUNT ZENER DIODES
VOLTAGE RANGE 2.4 to 75 Volts POWER 500 mWatt
FEATURES
MICRO-MELF
* Planar Die construction
* 500mW Power Dissipation
* Ideally Suited for Automated Assembly Processes
0.043(1.1)
MECHANICAL DATA
* Case: Molded Glass MICRO-MELF
* Terminals: Solderable per MIL-STD-750, Method 2026
0.008(0.2)
0.008(0.2)
0.079(2.0)
0.071(1.8)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25 oC ambient temperature unless otherwise specified.
Resistive or inductive load.
Dimensions in inches and (millimeters)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Parameter
Symbol
Value
500
Units
mW
Power Dissipation at T
Junction Temperature
Storage Temperature Range
Valid provided that leads at a distance of 8mm from case are kept at ambient temperature.
A
= 25OC
P
TOT
OC
OC
TJ
-65 to +175
-65 to +175
TS
Parameter
Symbol
RQJA
Min.
--
Typ.
--
Max.
0.3
Units
Thermal Resistance Junction to Ambient Air
oC/mW
V
Forward Voltage at IF = 200mA
VF
--
--
1.5
Valid provided that leads at a distance of 8mm from case are kept at ambient temperature.
2018-12/62
REV: O