Datasheet > BZM55-C27

BZM55-C27

更新时间： 2024-09-18 04:34:55

品牌	Logo	应用领域
强茂 - PANJIT		二极管齐纳二极管测试
页数	文件大小	规格书
3页	76K
描述
SURFACE MOUNT ZENER DIODES

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中文翻译

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BZM55-C27 数据手册

DATA SHEET

BZM55-C2V4 SERIES

SURFACE MOUNT ZENER DIODES

Unit : inch (mm)

MICRO-MELF

500 mWatts

POWER

VOLTAGE

2.4 to 47 Volts

FEATURES

• Planar Die construction

• 500mW Power Dissipation

• Ideally Suited for Automated Assembly Processes

MECHANICAL DATA

• Case: Molded Glass MICRO-MELF

• Terminals: Solderable per MIL-STD-202E, Method 208

• Polarity: See Diagram Below

.008(0.2)

.043(1.1)

.008(0.2)

.079(2.0)

.071(1.8)

• Approx. Weight: 0.01 grams

• Mounting Position: Any

•

Packing information

T/R - 2.5K per 7" plastic Reel

MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS

Parameter

Symbol

Value

Units

Power Dissipation at Tamb = 25 ^OC

500

175

TOT

Junction Temperature

^OC

Storage Temperature Range

-65 to +175

Valid provided that leads at a distance of 8mm from case are kept at ambient temperature.

Parameter

Symbol

Min.

Typ.

Max.

Units

Thermal Resistance Junction to Ambient Air

0.3

K/mW

RthA

Forward Voltage at IF = 100mA

Valid provided that leads at a distance of 8mm from case are kept at ambient temperature.

STAD-JAN.27.2004

PAGE . 1

12 3

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