Datasheet > BZD27C30P-TP

BZD27C30P-TP

更新时间： 2022-12-01 20:30:45

品牌	Logo	应用领域
美微科 - MCC		/
页数	文件大小	规格书
5页	459K
描述
Zener Diode, 30V V(Z), 5%, 0.8W, Silicon, Unidirectional, ROHS COMPLIANT, PLASTIC PACKAGE-2

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数据手册

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BZD27C30P-TP 数据手册

BZD27C6V2P

THRU

BZD27C200P

M C C

ꢀꢁꢂꢃꢄꢅꢆꢄꢇꢇꢈꢃꢂꢁꢉꢊꢅꢆomponents

20736 Marilla Street Chatsworth

ꢆꢋꢅꢌꢍꢎꢍꢍ

ꢏꢐꢄꢑꢈꢒꢅꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢎ

$ꢉ%ꢒꢅ ꢅ ꢅ ꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢌ

Micro Commercial Components

Features

High Surge Capability

•

Low profile surface-mount package.

0.8 Watt

Zener and TVS specification.

Zener Diode

6.2V - 200V Volts

•

Ideally Suited for Automatic Assembly

Standard V^ZTolerance is +/- 5%

Epoxy meets UL 94 V-0 flammability rating

Moisture Sensitivity Level 1

•

Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates

Compliant. See ordering information)

SOD-123FL

Maximum Ratings

•

Storage Temperature Range(TSTG): -65R to +175R

Operating Temperature Range(Tj): -65R to +175R

Symbol

Value

Pd/Vz

Units

Zener Curren

Power Dissipation

IZM

@T =105^oC

P_tot

2.3

0.8

@T =25^oC

Forward Voltage@I_F= 200mA

1.2

Junction to Lead

thJL

^oC/W

Thermal resistance

188

^oC/W

thJA

DIMENSIONS

Non-repetitive peak

DIM

INCHES

MIN

NOTE

300

PZSM

pulse power dissipation

MAX

.152

.112

.071

.053

.039

-----

.008

MIN

3.55

2.55

1.40

0.95

0.50

0.25

----

MAX

3.85

2.85

1.80

1.35

1.00

-----

.20

with 100 s square pulse

.140

.100

.055

.037

.020

.010

-----

Non-repetitive peak

150

PRSM

pulse power dissipation

with 10/1000 s waveform

Note :1.High Temperature Solder Exemptions Applied,See EU Directive Annex 7.

SUGGESTED SOLDER

PAD LAYOUT

0.093”

0.048”

0.036”

www.mccsemi.com

Revision: B

2011/09/19

1 of 5

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