BZD27B-M Series
Vishay Semiconductors
www.vishay.com
Zener Diodes with Surge Current Specification
FEATURES
• Sillicon planar Zener diodes
eSMP® Series
Available
• Voltage range includes 43 breakdown
voltages from 3.6 V to 200 V with 2 %
for BZD27B-M Series
1
2
• Low profile surface-mount package
• Zener and surge current specification
• Low leakage current
23018
23019
• Excellent stability
SMF (DO-219AB)
• Meets MSL level 1, per J-STD-020, LF maximum peak
of 260 °C
LINKS TO ADDITIONAL RESOURCES
• Meets JESD 201 class 2 whisker test
3
D
• ESD capability according to AEC-Q101:
human body model: > 8 kV
3D Models
machine model: > 800 V
PRIMARY CHARACTERISTICS
• Wave and reflow solderable
• AEC-Q101 qualified available
PARAMETER
VZ range nom.
Test current IZT
VBR
VALUE
3.6 to 200
5 to 100
UNIT
V
mA
V
• Base P/N-M3 - halogen-free, RoHS-compliant, and
commercial grade
7.35 to 196
6.2 to 160
150
• Base P/N-HM3 - halogen-free, RoHS-compliant, and
AEC-Q101 qualified (available on request)
VWM
V
PPPM
W
°C
• Compatible to SOD-123W package case outline or
SOD-123F and SOD-123FL
TJ max.
175
VZ specification
Int. construction
Polarity
Pulse current
Single
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
Uni-directional
ORDERING INFORMATION
DEVICE NAME
ORDERING CODE
TAPED UNITS PER REEL
3000 per 7" reel (8mm tape)
10 000 per 13" reel (8 mm tape)
MINIMUM ORDER QUANTITY
MOQ = 30K
BZD27B3V6P-M3-08 to BZD27B200P-M3-08
BZD27B3V6P-M3-18 to BZD27B200P-M3-18
BZD27B-M Series
MOQ = 50K
PACKAGE
MOLDING COMPOUND MOISTURESENSITIVITY WHISKER TEST
PACKAGE NAME WEIGHT
SOLDERING CONDITIONS
FLAMMABILITY RATING
LEVEL
ACC. JESD 201
MSL level 1
(according J-STD-020)
SMF (DO-219AB)
15 mg
UL 94 V-0
Class 2
Peak temperature max. 260 °C
ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified)
PARAMETER
TEST CONDITION
SYMBOL
VALUE
2300
800
UNIT
mW
mW
W
TL = 105 °C
Ptot
Power dissipation
T
A = 30 °C (1)
Ptot
100 μs square pulse
10/1000 μs waveform
PZSM
PRSM
RthJL
300
Non repetitive peak surge power dissipation (2)
150
W
Junction to lead
30
K/W
Mounted on epoxy-glass PCB with
3 mm x 3 mm Cu pads (≥ 40 μm thick)
Junction to ambient air
RthJA
180
K/W
Junction temperature
Tj
175
°C
°C
°C
Storage temperature range
Operating temperature range
Tstg
Top
-65 to +175
-65 to +175
Notes
(1)
Mounted on epoxy-glass PCB with 3 mm x 3 mm Cu pads (≥ 40 μm thick)
TJ = 25 °C prior to surge
(2)
Rev. 1.6, 26-Feb-2021
Document Number: 85922
1
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000