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BZD270C3V9A PDF预览

BZD270C3V9A

更新时间: 2024-09-25 14:48:15
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EIC /
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描述
Zener Diodes

BZD270C3V9A 数据手册

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www.eicsemi.com  
VOLTAGE REGULATOR DIODES  
BZD27-CxxA Series  
FEATURES :  
* High maximum operating temperature  
SMA  
2.3  
2.1  
* Low leakage current  
1.5  
1.1  
* Excellent stability  
* Zener working voltage range: 3.6 to 270 V for 46 types  
* Transient suppressor stand-off voltage range:  
6.2 to 430 V for 45 types  
0.2  
0.27  
0.13  
* Pb / RoHS Free  
2.5  
2.1  
2.9  
2.5  
MECHANICAL DATA :  
* Case : SMA Molded plastic  
* Epoxy : UL94V-0 rate flame retardant  
* Lead : Lead Formed for Surface Mount  
* Polarity : Color band denotes cathode end  
* Mounting position : Any  
2.1  
1.7  
Dimensions in millimeters  
* Weight : 0.067 gram  
MAXIMUM RATINGS  
Parameter  
Total Power dissipation  
Symbol  
Condition  
Min.  
Max.  
Unit  
Ttp = 105 °C; see Fog. 1 and 2  
Ptot  
-
-
1.7  
2.3  
W
BZD27-C3V6A to BZD27-C6V8A  
BZD27-C7V5A to BZD27-C510A  
Total Power dissipation  
PCB mounted  
Ptot  
-
-
0.8  
0.8  
W
BZD27-C3V6A to BZD27-C6V8A  
BZD27-C7V5A to BZD27-C510A  
Non-repetitive peak reverse  
Tamb = 60 °C, see Fig. 1  
Tamb = 55 °C, see Fig. 2  
tp = 100 µs; square pulse;  
Tj = 25°C prior to surge; see Fig. 5  
10/1000 µs exponential pulse (see Fig. 5)  
Tj = 25°C prior to surge  
PZSM  
PRSM  
-
-
300  
150  
W
W
power dissipation  
Non-repetitive peak reverse power  
dissipation (BZD27-C7V5A to -C510A)  
Forward voltage  
VF  
IF = 0.2 A; Tj = 25 °C  
-
-
1.2  
2.2  
V
BZD27-C3V6A to BZD27-C220A ; see Fig. 3  
BZD27-C240A to BZD27-C510A  
Junction and Storage Temperature Range  
BZD27-C3V6A to BZD27-C6V8A  
BZD27-C7V5A to BZD27-C510A  
TJ, TSTG  
°C  
-65  
-65  
+175  
+150  
THERMAL CHARACTERISTICS  
Symbol  
Parameter  
Condition  
Value  
Unit  
Thermal resistance from junction to tie-point  
BZD27-C3V6A to BZD27-C6V8A  
Rth j-tp  
K/W  
41  
20  
BZD27-C7V5A to BZD27-C510A  
Thermal resistance from junction to ambient  
BZD27-C3V6A to BZD27-C6V8A  
Rth j-a  
K/W  
Note 1  
144  
119  
BZD27-C7V5A to BZD27-C510A  
Note : (1) Device mounted on an epoxy-glass printed-circuit board, 1.5 mm thick; thickness of Cu-layer 40 µm on an must space.  
Page 1 of 4  
Rev. 02 : August 19, 2016  

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