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BZD270C13 PDF预览

BZD270C13

更新时间: 2024-11-13 14:47:51
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EIC /
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描述
Zener Diodes

BZD270C13 数据手册

 浏览型号BZD270C13的Datasheet PDF文件第2页浏览型号BZD270C13的Datasheet PDF文件第3页浏览型号BZD270C13的Datasheet PDF文件第4页 
TH09/2479  
IATF 0113686  
TH97/2478  
SGS TH07/1033  
VOLTAGE REGULATOR DIODES  
BZD27 Series  
MiniMELF (SOD-80)  
FEATURES :  
* High maximum operating temperature  
* Low leakage current  
* Excellent stability  
φ 1.6 ± 0.1  
* Zener working voltage range: 3.6 to 270 V for 46 types  
* Transient suppressor stand-off voltage range:  
6.2 to 430 V for 45 types  
0.4 ± 0.1  
3.5 ± 0.1  
* Pb / RoHS Free  
MECHANICAL DATA :  
* Plastic Case Mini MELF/ SOD-80  
Dimensions in millimeters  
* Terminals: plated terminals solderable  
per MIL-STD-750  
* Polarity : Color band denotes cathode  
end except Bipolar.  
* Mounting position : Any  
* Weight : 0.04 gram  
MAXIMUM RATINGS  
Parameter  
Total Power dissipation  
Symbol  
Condition  
Min.  
Max.  
Unit  
Ttp = 105 °C; see Fog. 1 and 2  
Ptot  
-
-
1.7  
2.3  
W
BZD27-C3V6 to BZD27-C6V8  
BZD27-C7V5 to BZD27-C510  
Total Power dissipation  
PCB mounted  
Ptot  
-
-
0.8  
0.8  
W
W
BZD27-C3V6 to BZD27-C6V8  
BZD27-C7V5 to BZD27-C510  
Non-repetitive peak reverse  
power dissipation  
Tamb = 60 °C, see Fig. 1  
Tamb = 55 °C, see Fig. 2  
tp = 100 µs; square pulse;  
Tj = 25°C prior to surge; see Fig. 5  
10/1000 µs exponential pulse (see Fig. 5)  
Tj = 25°C prior to surge  
PZSM  
-
300  
Non-repetitive peak reverse power  
dissipation (BZD27-C7V5 to -C510)  
Forward voltage  
PRSM  
VF  
-
-
150  
1.2  
W
V
IF = 0.2 A; Tj = 25 °C; see Fig. 3  
Junction and Storage Temperature Range  
BZD27-C3V6 to BZD27-C6V8  
BZD27-C7V5 to BZD27-C510  
TJ, TSTG  
°C  
-65  
-65  
+200  
+175  
THERMAL CHARACTERISTICS  
Parameter  
Symbol  
Condition  
Value  
Unit  
Thermal resistance from junction to tie-point  
BZD27-C3V6 to BZD27-C6V8  
Rth j-tp  
K/W  
55  
30  
BZD27-C7V5 to BZD27-C510  
Thermal resistance from junction to ambient  
BZD27-C3V6 to BZD27-C6V8  
Rth j-a  
K/W  
Note 1  
175  
150  
BZD27-C7V5 to BZD27-C510  
Note : (1) Device mounted on an epoxy-glass printed-circuit board, 1.5 mm thick; thickness of Cu-layer 40 µm on an must space.  
Page 1 of 4  
Rev. 02 : November 9, 2011  

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