BZD27-C56A

更新时间： 2024-01-28 03:08:14

品牌	Logo	应用领域
EIC		稳压二极管齐纳二极管
页数	文件大小	规格书
4页	136K
描述
VOLTAGE REGULATOR DIODES

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技术参数
数据手册

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BZD27-C56A 技术参数

是否无铅：	不含铅	生命周期：	Active
Reach Compliance Code：	compliant	ECCN代码：	EAR99
HTS代码：	8541.10.00.50	风险等级：	5.8
二极管类型：	ZENER DIODE	Base Number Matches：	1

BZD27-C56A 数据手册

TH97/10561QM

TW00/17276EM

IATF 0060636

SGS TH07/1033

VOLTAGE REGULATOR DIODES

BZD27-CxxA Series

SMA (DO-214AC)

FEATURES :

* High maximum operating temperature

1.1 ± 0.3

* Low leakage current

* Excellent stability

* Zener working voltage range: 3.6 to 270 V for 46 types

* Transient suppressor stand-off voltage range:

6.2 to 430 V for 45 types

0.2 ± 0.07

1.2 ± 0.2

2.1 ± 0.2

* Pb / RoHS Free

2.6 ± 0.15

MECHANICAL DATA :

* Case : SMA Molded plastic

* Epoxy : UL94V-O rate flame retardant

* Lead : Lead Formed for Surface Mount

* Polarity : Color band denotes cathode end

* Mounting position : Any

2.0 ± 0.2

Dimensions in millimeters

* Weight : 0.067 gram

MAXIMUM RATINGS

Parameter

Total Power dissipation

Symbol

Condition

Min.

Max.

Unit

Ttp = 105 °C; see Fog. 1 and 2

P_tot

1.7

2.3

BZD27-C3V6A to BZD27-C6V8A

BZD27-C7V5A to BZD27-C510A

Total Power dissipation

PCB mounted

P_tot

0.8

BZD27-C3V6A to BZD27-C6V8A

BZD27-C7V5A to BZD27-C510A

Non-repetitive peak reverse

Tamb = 60 °C, see Fig. 1

Tamb = 55 °C, see Fig. 2

tp = 100 µs; square pulse;

Tj = 25°C prior to surge; see Fig. 5

10/1000 µs exponential pulse (see Fig. 5)

Tj = 25°C prior to surge

P_ZSM

300

power dissipation

Non-repetitive peak reverse power

dissipation (BZD27-C7V5A to -C510A)

Forward voltage

P_RSM

V_F

150

1.2

I_F= 0.2 A; Tj = 25 °C; see Fig. 3

Junction and Storage Temperature Range

BZD27-C3V6A to BZD27-C6V8A

BZD27-C7V5A to BZD27-C510A

T_J, T_STG

°C

-65

+175

+150

THERMAL CHARACTERISTICS

Symbol

Parameter

Thermal resistance from junction to tie-point

BZD27-C3V6A to BZD27-C6V8A

BZD27-C7V5A to BZD27-C510A

Condition

Value

Unit

R_{th j-tp}

K/W

Thermal resistance from junction to ambient

BZD27-C3V6A to BZD27-C6V8A

BZD27-C7V5A to BZD27-C510A

R_{th j-a}

K/W

Note 1

144

119

Note : (1) Device mounted on an epoxy-glass printed-circuit board, 1.5 mm thick; thickness of Cu-laye≥r40 µm on an must space.

Page 1 of 4

Rev. 00 : February 13, 2008

12 3 4

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