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BYG20KAF PDF预览

BYG20KAF

更新时间: 2024-11-15 14:53:55
品牌 Logo 应用领域
鲁光 - LGE 整流二极管高效整流二极管
页数 文件大小 规格书
2页 1311K
描述
高效整流二极管

BYG20KAF 数据手册

 浏览型号BYG20KAF的Datasheet PDF文件第2页 
BYG20D-BYG20K  
Ultra Fast SMD Rectifiers  
VOLTAGE RANGE: 200 -- 600V  
CURRENT: 1.5 A  
Features  
SMAF  
For surface mounted applications  
Cathode Band  
Top View  
Glass passivated junction  
Low forward voltage drop  
0.110(2.80)  
0.094(2.40)  
0.059(1.50)  
0.051(1.30)  
High current capability  
Easily cleaned with Alcohol,Isopropnol  
and similar solvents  
0.145(3.70)  
0.128(3.25)  
0.012(0.30)  
0.004(0.10)  
0.059(1.50)  
0.039(1.00)  
The plastic material carries U/L  
recognition 94V-0  
0.047(1.20)  
0.028(0.60)  
Mechanical Data  
Case: JEDEC SMA,molded plastic  
0.190(4.85)  
0.172(4.35)  
Polarity: Color band denotes cathode end  
Weight: 0.002 ounces, 0.064 grams  
Dimensions in inches and(millimeters)  
Mounting position: Any  
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS  
Ratings at 25ambient temperature unless otherwise specified.  
Single phase,half wave,50 Hz,resistive or inductive load. For capacitive load,derate by 20%.  
UNITS  
BYG20D  
BYG20J BYG20K  
BYG20G  
VRRM  
VRMS  
VDC  
200  
140  
200  
600  
420  
600  
800  
560  
800  
Maximum recurrent peak reverse voltage  
Maximum RMS voltage  
400  
280  
400  
V
V
V
A
Maximum DC blocking voltage  
Average forward rectified current  
Peak forward surge current  
IF(AV)  
1.5  
IFSM  
30  
A
10 ms single half-sine-wave  
superimposed on rated load  
1.3  
1.4  
Maximum instantaneous  
forward voltage  
@ 1.0 A  
@ 1.5 A  
VF  
IR  
V
Maximum reverse current  
@TA=25  
1.0  
10  
µA  
at rated DC blocking voltage @TA=100℃  
Reverse recovery time (Note1)  
Typical thermal resistance (Note2)  
Typical thermal resistance (Note3)  
Operating temperature range  
trr  
75  
25  
ns  
K/W  
K/W  
RthJL  
RthJA  
Tj  
125  
- 55 -- +150  
- 55 -- +150  
TSTG  
Storage temperature range  
NOTE: 1. Reverse recovery test conditions: IF=0.5A,IR=1.0A,Irr=0.25A.  
2. Thermal resistance from junction to lead.  
3. Thermal resistance from junction to ambient.mounted on epoxy-glass hard tissue,50mm 2 35µm Cu.  
http://www.lgesemi.com  
mail:lge@lgesemi.com  
Revision:20170701-P1  

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