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BY527_10 PDF预览

BY527_10

更新时间: 2024-11-08 09:03:23
品牌 Logo 应用领域
威世 - VISHAY 二极管
页数 文件大小 规格书
4页 120K
描述
Standard Avalanche Sinterglass Diode

BY527_10 数据手册

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BY527  
Vishay Semiconductors  
Standard Avalanche Sinterglass Diode  
FEATURES  
• Controlled avalanche characteristics  
• Glass passivated junction  
• Hermetically sealed package  
• Low reverse current  
• High surge current capability  
• Compliant to RoHS directive 2002/95/EC and in  
accordance to WEEE 2002/96/EC  
949539  
• Halogen-free according to IEC 61249-2-21 definition  
MECHANICAL DATA  
Case: SOD-57  
APPLICATIONS  
• General purpose  
Terminals: plated axial leads, solderable per MIL-STD-750,  
method 2026  
Polarity: color band denotes cathode end  
Mounting position: any  
Weight: approx. 369 mg  
PARTS TABLE  
PART  
TYPE DIFFERENTIATION  
R = 800 V; IFAV = 2 A  
PACKAGE  
BY527  
V
SOD-57  
ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified)  
PARAMETER  
TEST CONDITION  
SYMBOL  
VRSM  
VR  
VALUE  
1250  
800  
50  
UNIT  
Reverse voltage, non repetitive  
Reverse voltage  
l
R = 100 μA  
V
V
See electrical characteristics  
tp = 10 ms, half sine wave  
Peak forward surge current  
Repetitive peak forward current  
Average forward current  
Pulse avalanche peak power  
IFSM  
A
A
A
W
lFRM  
12  
ϕ = 180°  
IFAV  
2
Tj = 175 °C, tp = 20 μs, half sinus wave  
PR  
1000  
Pulse energy in avalanche mode, non  
repetitive (inductive load switch off)  
l
(BR)R = 1 A, Tj = 175 °C  
ER  
20  
mJ  
i2t rating  
i2 t  
8
A2 s  
°C  
Junction and storage temperature range  
Tj = Tstg  
-55 to + 175  
MAXIMUM THERMAL RESISTANCE (Tamb = 25 °C, unless otherwise specified)  
PARAMETER  
TEST CONDITION  
SYMBOL  
VALUE  
UNIT  
Lead length l = 10 mm, TL = constant  
On PC board with spacing 25 mm  
RthJA  
45  
K/W  
K/W  
Junction ambient  
RthJA  
100  
www.vishay.com  
150  
For technical questions within your region, please contact one of the following:  
DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com  
Document Number: 86007  
Rev. 1.7, 25-Aug-10  

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