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BUK563-60A PDF预览

BUK563-60A

更新时间: 2024-11-25 22:13:35
品牌 Logo 应用领域
恩智浦 - NXP 晶体晶体管
页数 文件大小 规格书
8页 55K
描述
PowerMOS transistor Logic level FET

BUK563-60A 技术参数

生命周期:Obsolete包装说明:SMALL OUTLINE, R-PSSO-G2
Reach Compliance Code:unknownECCN代码:EAR99
风险等级:5.84其他特性:LOGIC LEVEL COMPATIBLE
雪崩能效等级(Eas):45 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:60 V
最大漏极电流 (ID):21 A最大漏源导通电阻:0.085 Ω
FET 技术:METAL-OXIDE SEMICONDUCTOR最大反馈电容 (Crss):160 pF
JESD-30 代码:R-PSSO-G2元件数量:1
端子数量:2工作模式:ENHANCEMENT MODE
最高工作温度:175 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
极性/信道类型:N-CHANNEL功耗环境最大值:75 W
最大脉冲漏极电流 (IDM):84 A认证状态:Not Qualified
表面贴装:YES端子形式:GULL WING
端子位置:SINGLE晶体管应用:SWITCHING
晶体管元件材料:SILICON最大关闭时间(toff):195 ns
最大开启时间(吨):150 nsBase Number Matches:1

BUK563-60A 数据手册

 浏览型号BUK563-60A的Datasheet PDF文件第2页浏览型号BUK563-60A的Datasheet PDF文件第3页浏览型号BUK563-60A的Datasheet PDF文件第4页浏览型号BUK563-60A的Datasheet PDF文件第5页浏览型号BUK563-60A的Datasheet PDF文件第6页浏览型号BUK563-60A的Datasheet PDF文件第7页 
Philips Semiconductors  
Product specification  
PowerMOS transistor  
Logic level FET  
BUK563-60A  
GENERAL DESCRIPTION  
QUICK REFERENCE DATA  
N-channel enhancement mode logic  
level field-effect power transistor in  
a plastic envelope suitable for  
surface mount applications.  
The device is intended for use in  
automotive and general purpose  
switching applications.  
SYMBOL  
PARAMETER  
MAX.  
UNIT  
VDS  
ID  
Drain-source voltage  
Drain current (DC)  
60  
21  
75  
175  
85  
V
A
W
˚C  
m  
Ptot  
Tj  
Total power dissipation  
Junction temperature  
Drain-source on-state  
RDS(ON)  
resistance  
VGS = 5 V  
PINNING - SOT404  
PIN CONFIGURATION  
SYMBOL  
PIN  
1
DESCRIPTION  
d
mb  
gate  
2
drain  
g
3
source  
2
mb drain  
1
3
s
LIMITING VALUES  
Limiting values in accordance with the Absolute Maximum System (IEC 134)  
SYMBOL PARAMETER  
CONDITIONS  
MIN.  
MAX.  
UNIT  
VDS  
Drain-source voltage  
-
-
-
-
-
60  
60  
15  
20  
V
V
V
V
VDGR  
±VGS  
±VGSM  
Drain-gate voltage  
RGS = 20 kΩ  
Gate-source voltage  
Non-repetitive gate-source  
voltage  
Drain current (DC)  
Drain current (DC)  
Drain current (pulse peak value)  
Total power dissipation  
Storage temperature  
Junction temperature  
-
tp 50 µs  
ID  
ID  
IDM  
Ptot  
Tstg  
Tj  
Tmb = 25 ˚C  
Tmb = 100 ˚C  
Tmb = 25 ˚C  
Tmb = 25 ˚C  
-
-
21  
15  
A
A
A
W
˚C  
˚C  
-
-
84  
-
- 55  
-
75  
175  
175  
-
THERMAL RESISTANCES  
SYMBOL PARAMETER  
CONDITIONS  
TYP. MAX. UNIT  
Rth j-mb  
Rth j-a  
Thermal resistance junction to  
-
-
2.0  
-
K/W  
K/W  
mounting base  
Thermal resistance junction to  
ambient  
minimum footprint,  
FR4 board (see Fig. 18).  
50  
July 1995  
1
Rev 1.000  

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