Philips Semiconductors
Objective specification
Silicon Diffused Power Transistor
BUJ301AX
GENERAL DESCRIPTION
High-voltage, high-speed planar-passivated npn power switching transistor in a plastic full-pack envelope intended
for use in high frequency electronic lighting ballast applications, converters, inverters, switching regulators, motor
control systems, etc.
QUICK REFERENCE DATA
SYMBOL PARAMETER
CONDITIONS
TYP. MAX. UNIT
VCESM
VCBO
VCEO
IC
Collector-emitter voltage peak value
VBE = 0 V
-
1000
1000
500
0.5
1
V
V
Collector-Base voltage (open emitter)
Collector-emitter voltage (open base)
Collector current (DC)
-
-
V
-
A
A
ICM
Collector current peak value
Total power dissipation
Collector-emitter saturation voltage
Fall time
-
Ptot
VCEsat
tf
Tmb ≤ 25 ˚C
-
-
32
W
V
IC = 0.2 A;IB =20m A
Ic=0.2A,IB1=20mA
1.0
160
145
ns
PINNING - SOT186A
PIN CONFIGURATION
SYMBOL
PIN
1
DESCRIPTION
c
case
base
2
collector
emitter
b
3
case isolated
1
2 3
e
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum Rating System (IEC 134)
SYMBOL PARAMETER
CONDITIONS
MIN. MAX. UNIT
VCESM
VCEO
VCBO
IC
Collector to emitter voltage
VBE = 0 V
-
1000
500
1000
0.5
1
0.2
0.3
32
150
150
V
V
Collector to emitter voltage (open base)
Collector to base voltage (open emitter)
Collector current (DC)
-
-
V
-
A
ICM
Collector current peak value
Base current (DC)
-
A
IB
IBM
Ptot
Tstg
Tj
-
A
Base current peak value
Total power dissipation
-
-
A
Tmb ≤ 25 ˚C
W
˚C
˚C
Storage temperature
-65
-
Junction temperature
THERMAL RESISTANCES
THERMAL RESISTANCES
SYMBOL PARAMETER
CONDITIONS
TYP. MAX. UNIT
Rth j-mb
Rth j-a
Junction to mounting base
Junction to ambient
-
3.95
-
K/W
K/W
in free air
55
August 1998
1
Rev 1.000