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BUB323Z_05 PDF预览

BUB323Z_05

更新时间: 2024-01-06 12:06:17
品牌 Logo 应用领域
安森美 - ONSEMI 高压
页数 文件大小 规格书
8页 91K
描述
NPN Silicon Power Darlington High Voltage Autoprotected D2PAK for Surface Mount

BUB323Z_05 数据手册

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BUB323Z  
NPN Silicon Power  
Darlington  
High Voltage Autoprotected  
D2PAK for Surface Mount  
http://onsemi.com  
The BUB323Z is a planar, monolithic, high−voltage power  
Darlington with a built−in active zener clamping circuit. This device is  
specifically designed for unclamped, inductive applications such as  
Electronic Ignition, Switching Regulators and Motor Control.  
AUTOPROTECTED  
DARLINGTON  
10 AMPERES  
360−450 VOLTS CLAMP  
150 WATTS  
Features  
Integrated High−Voltage Active Clamp  
Tight Clamping Voltage Window (350 V to 450 V) Guaranteed  
Over the 40°C to +125°C Temperature Range  
Clamping Energy Capability 100% Tested in a Live  
Ignition Circuit  
360 V  
CLAMP  
High DC Current Gain/Low Saturation Voltages  
Specified Over Full Temperature Range  
Design Guarantees Operation in SOA at All Times  
Pb−Free Packages are Available  
MAXIMUM RATINGS  
MARKING  
DIAGRAM  
Rating  
Symbol  
Value  
350  
Unit  
Vdc  
Vdc  
Adc  
Collector−Emitter Sustaining Voltage  
Collector−Emitter Voltage  
V
CEO  
EBO  
V
6.0  
Collector Current − Continuous  
− Peak  
I
10  
20  
C
BUB323ZG  
AYWW  
I
I
CM  
Base Current  
− Continuous  
− Peak  
I
3.0  
6.0  
Adc  
B
2
D PAK  
BM  
CASE 418B  
STYLE 1  
Total Power Dissipation  
P
D
@ T = 25_C  
150  
1.0  
C
W
Derate above 25_C  
W/_C  
_C  
Operating and Storage Junction  
Temperature Range  
T , T  
65 to  
+175  
J
stg  
BUB323Z = Specific Device Code  
A
Y
= Assembly Location  
= Year  
THERMAL CHARACTERISTICS  
Characteristic  
WW  
G
= Work Week  
= Pb−Free Package  
Symbol  
Max  
1.0  
Unit  
_C/W  
_C/W  
_C  
Thermal Resistance, Junction−to−Case  
Thermal Resistance, Junction−to−Ambient  
R
q
JC  
R
62.5  
260  
q
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 6 of this data sheet.  
JA  
L
Maximum Lead Temperature  
for Soldering Purposes,  
T
1/8 in from Case for 5 Seconds  
Maximum ratings are those values beyond which device damage can occur.  
Maximum ratings applied to the device are individual stress limit values (not  
normal operating conditions) and are not valid simultaneously. If these limits are  
exceeded, device functional operation is not implied, damage may occur and  
reliability may be affected.  
©
Semiconductor Components Industries, LLC, 2005  
1
Publication Order Number:  
August, 2005 − Rev. 1  
BUB323Z/D  

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