是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 零件包装代码: | BGA |
包装说明: | TFBGA, BGA63,8X8,20 | 针数: | 63 |
Reach Compliance Code: | compliant | HTS代码: | 8542.39.00.01 |
风险等级: | 5.7 | Is Samacsys: | N |
其他特性: | IT ALSO REQUIRES 1.65V TO 3.1V SUPPLY | 商用集成电路类型: | CONSUMER CIRCUIT |
JESD-30 代码: | S-PBGA-B63 | JESD-609代码: | e1 |
长度: | 5 mm | 功能数量: | 1 |
端子数量: | 63 | 最高工作温度: | 85 °C |
最低工作温度: | -30 °C | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | TFBGA | 封装等效代码: | BGA63,8X8,20 |
封装形状: | SQUARE | 封装形式: | GRID ARRAY, THIN PROFILE, FINE PITCH |
峰值回流温度(摄氏度): | 260 | 电源: | 1.8,2.8 V |
认证状态: | Not Qualified | 座面最大高度: | 1.2 mm |
子类别: | Other Consumer ICs | 最大供电电压 (Vsup): | 3.1 V |
最小供电电压 (Vsup): | 2.7 V | 表面贴装: | YES |
温度等级: | OTHER | 端子面层: | Tin/Silver/Copper (Sn/Ag/Cu) |
端子形式: | BALL | 端子节距: | 0.5 mm |
端子位置: | BOTTOM | 处于峰值回流温度下的最长时间: | 10 |
宽度: | 5 mm | Base Number Matches: | 1 |
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