Datasheet > BU21008MUV-E2

BU21008MUV-E2

更新时间： 2024-09-26 14:48:11

品牌	Logo	应用领域
罗姆 - ROHM		商用集成电路
页数	文件大小	规格书
15页	444K
描述
Consumer Circuit, 5 X 5 MM, ROHS COMPLIANT, VQFN-032

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BU21008MUV-E2 技术参数

是否无铅：	不含铅	是否Rohs认证：	符合
生命周期：	Active	零件包装代码：	QFN
包装说明：	5 X 5 MM, ROHS COMPLIANT, VQFN-032	针数：	32
Reach Compliance Code：	compliant	HTS代码：	8542.39.00.01
Factory Lead Time：	8 weeks	风险等级：	5.1
其他特性：	IT ALSO REQUIRES 1.7V TO 3.3V DIGITAL SUPPLY	商用集成电路类型：	CONSUMER CIRCUIT
JESD-30 代码：	S-XQCC-N32	长度：	5 mm
功能数量：	1	端子数量：	32
最高工作温度：	85 °C	最低工作温度：	-40 °C
封装主体材料：	UNSPECIFIED	封装代码：	HVQCCN
封装等效代码：	LCC32,.2SQ,20	封装形状：	SQUARE
封装形式：	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	峰值回流温度（摄氏度）：	NOT SPECIFIED
电源：	1.8/3,3 V	认证状态：	Not Qualified
座面最大高度：	1 mm	子类别：	Other Consumer ICs
最大供电电压 (Vsup)：	3.3 V	最小供电电压 (Vsup)：	2.5 V
表面贴装：	YES	温度等级：	INDUSTRIAL
端子形式：	NO LEAD	端子节距：	0.5 mm
端子位置：	QUAD	处于峰值回流温度下的最长时间：	NOT SPECIFIED
宽度：	5 mm	Base Number Matches：	1

BU21008MUV-E2 数据手册

Capacitive Sensor Control IC Series

Capacitive Sensor Switch

Control IC

BU21008MUV

No.09048EBY01

●Note in capacitive sensor board design

Here, it explains a recommended value and recommended condition concerning the board, the overlay, and mounting when

BU21008MUV of capacitive sensor IC series and the composition by a solid board are assumed.

It is not the one to do the operation guarantee though a recommended value and recommended condition are made based

on the result of the real machine experiment by an experimental board. On the other hand, it is not the one to fix immovable

when not satisfying it either.

It treats as a reference of an initial examination, and finally, please experiment the principle by the use of a real machine, and

judge the quality of the system by the mounting experiment.

・Board

Item

Material

Numerical value

Other condition

Board material

thickness =1.6mm or more

2 layer both sides structure

FR4（glass epoxy)

Electrode

material

thickness =10um-50um

36mm over - finger contact

area twice or less

Electrode size

Electrode form

Wiring width

Wiring length

Via size

0.2mm or less

100mm or less

0.4mm or less

Shape doesn't influence sensitivity

The minimum value of the design rule

of the board is applied

The minimum value of the design rule

of the board is applied

1) About the size of the sensor electrode

①The area of the sensor must do Hi and become twice or more the gross area of wiring.

②Please give the twice the contact side product of the assumed finger to the upper bound of the area of the sensor as a

standard.

③Please give 36mm²to the lower bound of the area of the sensor as a standard.

2) About the form of the sensor electrode

①The shape of the sensor doesn't have a big influence in the sensitivity of the sensor.

Given the shape of the finger-like circular and rectangular, and is appropriate.

②The design with the copyright like the registration of a design etc. exists, and note special shape, please.

3) Method of setting up sensor electrode and wiring

①The grand area arrangement around the sensor electrode and the sensor wiring is recommended.

Please arrange a grand area in the same to sensor electrode layer, and open the gap between a sensor electrode and

grand area by 1.0mm or more (To decrease a parasitic capacitance increase).

②The grand area arrangement in the back of the sensor electrode and wiring is recommended.

Please arrange a grand area to cover all opposed the sensor electrodes with another layer on the back side of the

sensor electrode. The device that suppresses a parasitic capacitance increase such as grand shape being made a

mesh is necessary following the thickness 1.6mm in the FR4 board. In that case, please consult separately.

www.rohm.com

2009.04 - Rev.B

1/14

12 3 4 5 6 7...15

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