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BSP62T1 PDF预览

BSP62T1

更新时间: 2024-11-29 22:39:39
品牌 Logo 应用领域
摩托罗拉 - MOTOROLA 晶体晶体管达林顿晶体管
页数 文件大小 规格书
6页 182K
描述
MEDIUM POWER PNP SILICON DARLINGTON TRANSISTOR SURFACE MOUNT

BSP62T1 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
Reach Compliance Code:unknown风险等级:5.88
外壳连接:COLLECTOR最大集电极电流 (IC):0.5 A
集电极-发射极最大电压:80 V配置:DARLINGTON
最小直流电流增益 (hFE):2000JEDEC-95代码:TO-261AA
JESD-30 代码:R-PDSO-G4JESD-609代码:e0
元件数量:1端子数量:4
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:PNP
认证状态:Not Qualified子类别:Other Transistors
表面贴装:YES端子面层:Tin/Lead (Sn/Pb)
端子形式:GULL WING端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

BSP62T1 数据手册

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Order this document  
by BSP62T1/D  
SEMICONDUCTOR TECHNICAL DATA  
Motorola Preferred Device  
This PNP small signal darlington transistor is designed for use in switching  
applications, such as print hammer, relay, solenoid and lamp drivers. The device is  
housed in the SOT-223 package which is designed for medium power surface mount  
applications.  
MEDIUM POWER  
PNP SILICON  
DARLINGTON  
TRANSISTOR  
SURFACE MOUNT  
The SOT-223 Package can be soldered using wave or reflow. The formed  
leads absorb thermal stress during soldering, eliminating the possibility of  
damage to the die  
Available in 12 mm Tape and Reel  
Use BSP62T1 to order the 7 inch/1000 unit reel.  
Use BSP62T3 to order the 13 inch/4000 unit reel.  
4
COLLECTOR 2,4  
1
2
3
NPN Complement is BSP52T1  
BASE  
1
CASE 318E-04, STYLE 1  
TO-261AA  
EMITTER 3  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
C
Rating  
Collector-Emitter Voltage  
Collector-Base Voltage  
Symbol  
Value  
80  
Unit  
Vdc  
V
CES  
CBO  
EBO  
V
V
90  
Vdc  
Emitter-Base Voltage  
5.0  
Vdc  
Collector Current  
I
C
500  
mAdc  
(1)  
Total Power Dissipation @ T = 25°C  
Derate above 25°C  
P
D
1.5  
12  
Watts  
mW/°C  
A
Operating and Storage Temperature Range  
DEVICE MARKING  
T , T  
65 to 150  
°C  
J
stg  
BS3  
THERMAL CHARACTERISTICS  
Characteristic  
Symbol  
Max  
Unit  
Thermal Resistance — Junction-to-Ambient (surface mounted)  
R
83.3  
°C/W  
θJA  
Maximum Temperature for Soldering Purposes  
Time in Solder Bath  
T
L
260  
10  
°C  
Sec  
1. Device mounted on a FR–4 glass epoxy printed circuit board 1.575 in. x 1.575 in. x 0.0625 in.; mounting pad for the collector lead = 0.93 sq. in.  
Thermal Clad is a trademark of the Bergquist Company  
Preferred devices are Motorola recommended choices for future use and best overall value.  
REV 2  
Motorola, Inc. 1996  

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