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BSE-060-01-C-D-A-TR

更新时间： 2024-09-17 18:32:31
品牌 Logo 应用领域
申泰 - SAMTEC 连接器
页数 文件大小 规格书
1页 700K
描述
Board Stacking Connector, 120 Contact(s), 2 Row(s), Female, Straight, Surface Mount Terminal, Socket, ROHS COMPLIANT

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BSE-060-01-C-D-A-TR 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Active包装说明：ROHS COMPLIANT
Reach Compliance Code：compliantECCN代码：EAR99
HTS代码：8536.69.40.40风险等级：5.78
其他特性：E.L.P主体/外壳类型：SOCKET
连接器类型：BOARD STACKING CONNECTOR联系完成配合：GOLD (50) OVER NICKEL (150)
联系完成终止：Tin (Sn) - with Nickel (Ni) barrier触点性别：FEMALE
触点材料：PHOSPHOR BRONZEDIN 符合性：NO
滤波功能：NOIEC 符合性：NO
JESD-609代码：e3MIL 符合性：NO
插接信息：MULTIPLE MATING PARTS AVAILABLE混合触点：NO
安装方式：STRAIGHT安装类型：BOARD
装载的行数：2选件：GENERAL PURPOSE
端子节距：0.8 mm端接类型：SURFACE MOUNT
触点总数：120Base Number Matches：1

BSE-060-01-C-D-A-TR 数据手册

  
F214 (Rev 06MAR14)  
BSE–020–01–F–D–A  
BTE–060–02–F–D–A  
BTE–040–02–L–D–A  
(0,80 mm) .0315"  
BTE, BSE SERIES  
BASIC BLADE & BEAM HEADER & SOCKET  
SPECIFICATIONS  
For complete specifications and  
recommended PCB layouts see  
www.samtec.com?BTE or  
www.samtec.com?BSE  
OTHER  
NO. OF POSITIONS  
PER ROW  
PLATING  
OPTION  
LEAD  
BTE  
A
D
OPTION  
STYLE  
Mates with:  
BSE  
Specify  
LEAD  
STYLE  
from  
Insulator Material:  
–K  
Liquid Crystal Polymer  
Contact Material:  
= (7,00 mm)  
.275" DIA  
Polyimide  
Film Pick  
& Place Pad  
–F  
Phosphor Bronze  
= Gold Flash on contact,  
Matte Tin on tail  
Plating: Au or Sn over  
50µ" (1,27 µm) Ni  
–020, –040, –060,  
–080, –100, –120  
chart  
Current Rating: 2 A per pin  
(1 pin powered per row)  
OperatingTemp Range:  
-55°C to +125°C  
–L  
= 10µ" (0,25 µm) Gold on contact,  
Matte Tin on tail  
–TR  
LEAD  
STYLE  
A
= Tape & Reel  
(60 positions  
maximum)  
Voltage Rating: 225 VAC with  
5 mm Stack Height  
No. of positions x (0,80) .0315  
+ (4,00) .1575  
(4,27)  
.168  
–C*  
Max Cycles: 100  
–01  
–02  
01  
= Electro-Polished Selective  
50µ" (1,27 µm) min Au over  
150µ" (3,81 µm) Ni on  
Signal Pins in contact area,  
Matte Tin over 50µ" (1,27 µm) min  
Ni on all solder tails  
RoHS Compliant: Yes  
(7,21)  
.284  
(5,97)  
.235  
(3,94)  
.155  
Processing:  
Lead-Free Solderable: Yes  
SMT Lead Coplanarity:  
(0,10 mm) .004" max (020-080)  
(0,15 mm) .006" max (100-120)  
Board Stacking:  
02  
(0,80) .0315  
(7,11)  
.280  
*Note: –C Plating passes  
10 year MFG testing  
For applications requiring more  
than two connectors per board  
or 80 positions or higher,  
contact ipg@samtec.com  
(0,76)  
.030  
A
(0,20)  
.008  
(0,89)  
.035  
DIA  
RECOGNITIONS  
For complete scope  
of recognitions see  
www.samtec.com/quality  
• Passes  
10 year MFG  
OTHER  
NO. OF POSITIONS  
PER ROW  
PLATING  
OPTION  
BSE  
01  
A
D
MATED HEIGHT  
OPTION  
LEAD  
STYLE  
MATED  
HEIGHT*  
Mates with:  
BTE  
(5,00) .197  
–01  
–02  
(8,00) .315  
–F  
*Processing conditions will  
affect mated height.  
–TR  
= Gold Flash on contact,  
Matte Tin on tail  
= Tape & Reel  
(80 positions  
maximum)  
–020, –040, –060,  
–080, –100, –120  
ALSO AVAILABLE  
–L  
(MOQ Required)  
= 10µ" (0,25 µm) Gold on contact,  
Matte Tin on tail  
• 30µ" (0,76 µm) Gold  
• Edge Mount Capability  
• Friction Lock option  
• 11 mm, 14 mm, 16,10 mm,  
19,10 mm, 22 mm,  
25 mm and 30 mm Stack  
Height (Caution: Some  
automatic placement/  
inspection machines may  
have component height  
restrictions. Please consult  
machinery specifications.)  
–C*  
= Electro-Polished Selective  
50µ" (1,27 µm) min Au over  
150µ" (3,81 µm) Ni on Signal Pins in  
contact area, MatteTin over  
50µ" (1,27 µm) min Ni on all solder tails  
No. of positions x (0,80) .0315  
+ (5,27) .2075  
02  
01  
(6,22)  
.245  
(3,81) (7,24)  
.150 .285  
*Note: –C Plating passes 10 year MFG testing  
(0,80) .0315  
(3,25)  
.128  
(7,49)  
.295  
(0,76)  
.030  
(1,78)  
.070  
Contact Samtec.  
(0,15)  
.006  
(0,89)  
.035  
DIA  
Note: Some lengths, styles  
and options are non-standard,  
non-returnable.  
(3,05)  
.120  
WWW.SAMTEC.COM  
1

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