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BSC0902NSI_15

更新时间: 2024-09-26 01:15:07
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
1页 33K
描述
Material Content Data Sheet

BSC0902NSI_15 数据手册

  
Material Content Data Sheet  
Sales Product Name BSC0901NSI  
Issued  
14. August 2015  
118.48 mg  
MA#  
MA001025842  
PG-TDSON-8-6  
Package  
Weight*  
Average  
Mass  
[%]  
Average  
CAS#  
Weight  
[mg]  
Sum  
Mass  
[%]  
Sum  
Construction Element  
Material Group  
Substances  
[ppm]  
if applicable  
[ppm]  
chip  
inorganic material  
non noble metal  
inorganic material  
non noble metal  
noble metal  
silicon  
7440-21-3  
7439-89-6  
7723-14-0  
7440-50-8  
7440-57-5  
1333-86-4  
-
0.629  
0.038  
0.011  
37.762  
0.045  
0.088  
6.215  
37.464  
1.470  
0.166  
0.023  
0.019  
0.895  
0.011  
0.003  
11.320  
0.022  
0.007  
22.292  
0.53  
0.03  
0.01  
31.87  
0.04  
0.07  
5.25  
31.62  
1.24  
0.14  
0.02  
0.02  
0.76  
0.01  
0.00  
9.55  
0.02  
0.01  
18.81  
0.53  
5310  
319  
5310  
leadframe  
iron  
phosphorus  
copper  
gold  
96  
31.91  
0.04  
318720  
380  
319135  
380  
wire  
encapsulation  
organic material  
plastics  
carbon black  
epoxy resin  
silicondioxide  
tin  
739  
52455  
316209  
12406  
1397  
198  
inorganic material  
non noble metal  
noble metal  
60676-86-0  
7440-31-5  
7440-22-4  
7440-22-4  
7440-31-5  
7439-92-1  
7439-89-6  
7723-14-0  
7440-50-8  
7439-89-6  
7723-14-0  
7440-50-8  
36.94  
1.24  
0.14  
369403  
12406  
1397  
leadfinish  
plating  
silver  
solder  
noble metal  
silver  
non noble metal  
non noble metal  
non noble metal  
inorganic material  
non noble metal  
non noble metal  
inorganic material  
non noble metal  
< 10%  
tin  
158  
lead  
0.80  
9.56  
7550  
96  
7906  
heatspreader  
heat sink CLIP  
*deviation  
iron  
phosphorus  
copper  
iron  
29  
95545  
188  
95670  
phosphorus  
copper  
57  
18.84  
188148  
188393  
Sum in total: 100.00  
1000000  
Important Remarks:  
1.  
2.  
3.  
Infineon Technologies AG provides full material declaration based on information provided by third parties and  
has taken and continues to take reasonable steps to provide representative and accurate information.  
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be  
proprietary, and thus CAS numbers and other limited information may not be available for release.  
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any  
time due to technical requirements and development without notification.  
This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption  
7a, Lead in high melting temperature type solders.  
Company  
Address  
Internet  
Infineon Technologies AG  
81726 München  
www.infineon.com  

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