Material Content Data Sheet
Sales Product Name BSC0901NSI
Issued
14. August 2015
118.48 mg
MA#
MA001025842
PG-TDSON-8-6
Package
Weight*
Average
Mass
[%]
Average
CAS#
Weight
[mg]
Sum
Mass
[%]
Sum
Construction Element
Material Group
Substances
[ppm]
if applicable
[ppm]
chip
inorganic material
non noble metal
inorganic material
non noble metal
noble metal
silicon
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7440-57-5
1333-86-4
-
0.629
0.038
0.011
37.762
0.045
0.088
6.215
37.464
1.470
0.166
0.023
0.019
0.895
0.011
0.003
11.320
0.022
0.007
22.292
0.53
0.03
0.01
31.87
0.04
0.07
5.25
31.62
1.24
0.14
0.02
0.02
0.76
0.01
0.00
9.55
0.02
0.01
18.81
0.53
5310
319
5310
leadframe
iron
phosphorus
copper
gold
96
31.91
0.04
318720
380
319135
380
wire
encapsulation
organic material
plastics
carbon black
epoxy resin
silicondioxide
tin
739
52455
316209
12406
1397
198
inorganic material
non noble metal
noble metal
60676-86-0
7440-31-5
7440-22-4
7440-22-4
7440-31-5
7439-92-1
7439-89-6
7723-14-0
7440-50-8
7439-89-6
7723-14-0
7440-50-8
36.94
1.24
0.14
369403
12406
1397
leadfinish
plating
silver
solder
noble metal
silver
non noble metal
non noble metal
non noble metal
inorganic material
non noble metal
non noble metal
inorganic material
non noble metal
< 10%
tin
158
lead
0.80
9.56
7550
96
7906
heatspreader
heat sink CLIP
*deviation
iron
phosphorus
copper
iron
29
95545
188
95670
phosphorus
copper
57
18.84
188148
188393
Sum in total: 100.00
1000000
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption
7a, Lead in high melting temperature type solders.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com