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BRUS550 PDF预览

BRUS550

更新时间: 2024-11-26 03:22:39
品牌 Logo 应用领域
EDI 散热片二极管PC局域网快速恢复二极管
页数 文件大小 规格书
2页 61K
描述
ULTRA-FAST RECOVERY 4 to 6 AMPERES SINGLE-PHASE, FULL-WAVE BRIDGES HEAT SINK CHASSIS PC BOARD MOUNTING

BRUS550 技术参数

生命周期:Contact Manufacturer包装说明:R-PSFM-W4
Reach Compliance Code:unknownHTS代码:8541.10.00.80
风险等级:5.78其他特性:UL RECOGNIZED
外壳连接:ISOLATED配置:BRIDGE, 4 ELEMENTS
二极管元件材料:SILICON二极管类型:BRIDGE RECTIFIER DIODE
最大正向电压 (VF):1.2 VJESD-30 代码:R-PSFM-W4
最大非重复峰值正向电流:240 A元件数量:4
相数:1端子数量:4
最高工作温度:150 °C最大输出电流:5 A
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:FLANGE MOUNT认证状态:Not Qualified
最大重复峰值反向电压:500 V最大反向恢复时间:0.05 µs
子类别:Bridge Rectifier Diodes表面贴装:NO
端子形式:WIRE端子位置:SINGLE
Base Number Matches:1

BRUS550 数据手册

 浏览型号BRUS550的Datasheet PDF文件第2页 
BRUS1 BRUS5  
MINIBRIDGE  
50 ns. ULTRA-FAST RECOVERY  
4 to 6 AMPERES  
SINGLE-PHASE, FULL-WAVE BRIDGES  
HEAT SINK CHASSIS PC BOARD MOUNTING  
BRUS1  
3A PC MOUNTING  
4A HEAT SINK MOUNTING  
BRUS5  
5A PC BOARD MOUNTING  
6A HEAT SINK MOUNTING  
PRV/LEG  
50V  
100V  
200V  
400V  
500V  
600V  
BRUS1 SERIES BRUS105  
BRUS110  
BRUS120  
BRUS140  
BRUS150  
BRUS160  
BRUS5 SERIES  
BRUS505  
BRUS510  
BRUS520  
BRUS540  
BRUS550  
BRUS560  
SERIES DESIGNATION  
BRUS1 BRUS5  
4 6  
ELECTRICAL CHARACTERISTICS PER LEG  
(at T  
A
=25 C Unless O the rwis e Sp eci fied)  
UNITS  
Amps  
O
Average Output Current, lo @ 60 C T (Fig.1)  
c
O
Average Output Current, lo @ 80 C T  
(Fig.2)  
Amps  
3
5
L
BRUS1 Series = 2A  
BRUS5 Series = 4A  
Max. Forward Voltage Drop,  
1.3  
1.3  
Volts  
IF  
IR  
Max.DC Reverse Current @ PRV and 25 C ,  
A
10  
10  
C IR  
,
Max.DC Reverse Current @ PRV and 100  
A
200  
200  
Max.Reverse Recovery Time,Trr (Fig.3)  
Nanosec.  
50  
50  
Amps  
Max.Peak Surge Current, lFSM (8.3ms) (Fig.2)  
100  
240  
o
Storage Temperature Range, TSTG  
-55 to+150  
C
o
-55 to+150  
Ambient Operating Temperature Range,TA  
C
o
-
Thermal Resistance (Total Bridge), R0  
7.7 typ.  
8.7 typ.  
C/W  
c
-
j
NOTE: A thin film of silicone thermal compound is recommended between the Minibridge  
case and mounting surface for improved thermal conduction.  
EDI reserves the right to change these specifications at any time without notice.  

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