生命周期: | Active | 零件包装代码: | SOIC |
包装说明: | ROHS COMPLIANT, SOP-8 | 针数: | 8 |
Reach Compliance Code: | compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.32.00.51 | 风险等级: | 5.73 |
Is Samacsys: | N | JESD-30 代码: | R-PDSO-G8 |
长度: | 5 mm | 内存密度: | 65536 bit |
内存集成电路类型: | EEPROM | 内存宽度: | 8 |
功能数量: | 1 | 端子数量: | 8 |
字数: | 8192 words | 字数代码: | 8000 |
工作模式: | SYNCHRONOUS | 最高工作温度: | 105 °C |
最低工作温度: | -40 °C | 组织: | 8KX8 |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | SOP |
封装形状: | RECTANGULAR | 封装形式: | SMALL OUTLINE |
并行/串行: | SERIAL | 认证状态: | Not Qualified |
座面最大高度: | 1.78 mm | 串行总线类型: | I2C |
最大供电电压 (Vsup): | 5.5 V | 最小供电电压 (Vsup): | 2.5 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | INDUSTRIAL | 端子形式: | GULL WING |
端子节距: | 1.27 mm | 端子位置: | DUAL |
宽度: | 4.4 mm | 最长写入周期时间 (tWC): | 5 ms |
Base Number Matches: | 1 |
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