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| 型号 | 品牌 | 获取价格 | 描述 | 数据表 |
| BR24S02FVJ-WE2 | ROHM |
获取价格 |
High Reliability Series EEPROMs I2C BUS |
|
| BR24S02FVJ-WTR | ROHM |
获取价格 |
High Reliability Series EEPROMs I2C BUS |
|
| BR24S02FVM-WE2 | ROHM |
获取价格 |
High Reliability Series EEPROMs I2C BUS |
|
| BR24S02FVM-WTR | ROHM |
获取价格 |
High Reliability Series EEPROMs I2C BUS |
|
| BR24S02FVT-WE2 | ROHM |
获取价格 |
High Reliability Series EEPROMs I2C BUS |
|
| BR24S02FVT-WTR | ROHM |
获取价格 |
High Reliability Series EEPROMs I2C BUS |
|
| BR24S02FV-WE2 | ROHM |
获取价格 |
High Reliability Series EEPROMs I2C BUS |
|
| BR24S02FV-WTR | ROHM |
获取价格 |
High Reliability Series EEPROMs I2C BUS |
|
| BR24S02F-WE2 | ROHM |
获取价格 |
High Reliability Series EEPROMs I2C BUS |
|
| BR24S02F-WTR | ROHM |
获取价格 |
High Reliability Series EEPROMs I2C BUS |
|
英伟达新AI芯片Rubin或提前半年亮相
苹果iPhone 17将全系采用三星/LG显示LTPO OLED面板
三星深化印度制造布局，供应链本地化进程加速
芯擎科技“星辰一号”自动驾驶芯片点亮成功，2025年量产在即
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