是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Obsolete | 包装说明: | VFBGA, |
Reach Compliance Code: | compliant | 风险等级: | 5.8 |
可调阈值: | YES | 模拟集成电路 - 其他类型: | POWER SUPPLY MANAGEMENT CIRCUIT |
JESD-30 代码: | R-XBGA-B36 | JESD-609代码: | e1 |
长度: | 2.455 mm | 湿度敏感等级: | 1 |
信道数量: | 1 | 功能数量: | 1 |
端子数量: | 36 | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 封装主体材料: | UNSPECIFIED |
封装代码: | VFBGA | 封装形状: | RECTANGULAR |
封装形式: | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | 座面最大高度: | 0.625 mm |
最大供电电流 (Isup): | 6.65 mA | 最大供电电压 (Vsup): | 28 V |
最小供电电压 (Vsup): | 4.2 V | 标称供电电压 (Vsup): | 5 V |
表面贴装: | YES | 温度等级: | INDUSTRIAL |
端子面层: | Tin/Silver/Copper (Sn/Ag/Cu) | 端子形式: | BALL |
端子节距: | 0.4 mm | 端子位置: | BOTTOM |
阈值电压标称: | 0.15 | 宽度: | 2.455 mm |
Base Number Matches: | 1 |
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bq24192I | TI |
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