是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 零件包装代码: | BGA |
包装说明: | DSBGA-20 | 针数: | 20 |
Reach Compliance Code: | compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.39.00.01 | Factory Lead Time: | 6 weeks |
风险等级: | 0.78 | Samacsys Confidence: | 4 |
Samacsys Status: | Released | Samacsys PartID: | 755802 |
Samacsys Pin Count: | 20 | Samacsys Part Category: | Integrated Circuit |
Samacsys Package Category: | BGA | Samacsys Footprint Name: | YFF (R-XBGA-N20) |
Samacsys Released Date: | 2017-09-13 09:58:22 | Is Samacsys: | N |
可调阈值: | YES | 模拟集成电路 - 其他类型: | POWER SUPPLY SUPPORT CIRCUIT |
JESD-30 代码: | R-XBGA-B20 | JESD-609代码: | e1 |
长度: | 2.14 mm | 湿度敏感等级: | 1 |
信道数量: | 1 | 功能数量: | 1 |
端子数量: | 20 | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 封装主体材料: | UNSPECIFIED |
封装代码: | VFBGA | 封装等效代码: | BGA20,4X5,16 |
封装形状: | RECTANGULAR | 封装形式: | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
峰值回流温度(摄氏度): | 260 | 电源: | 5 V |
认证状态: | Not Qualified | 座面最大高度: | 0.625 mm |
子类别: | Power Management Circuits | 最大供电电流 (Isup): | 5 mA |
最大供电电压 (Vsup): | 6 V | 最小供电电压 (Vsup): | 4 V |
标称供电电压 (Vsup): | 5 V | 表面贴装: | YES |
温度等级: | INDUSTRIAL | 端子面层: | Tin/Silver/Copper (Sn/Ag/Cu) |
端子形式: | BALL | 端子节距: | 0.4 mm |
端子位置: | BOTTOM | 阈值电压标称: | +3.3V |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | 宽度: | 2 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 替代类型 | 描述 | 数据表 |
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