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CAT16-LV4F12 PDF预览

CAT16-LV4F12

更新时间: 2024-02-09 04:58:58
品牌 Logo 应用领域
伯恩斯 - BOURNS /
页数 文件大小 规格书
1页 343K
描述
Concave Chip Array

CAT16-LV4F12 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:SMT, 2506Reach Compliance Code:compliant
ECCN代码:EAR99Factory Lead Time:12 weeks
风险等级:1.52Is Samacsys:N
构造:Chip第一元件电阻:165 Ω
JESD-609代码:e3安装特点:SURFACE MOUNT
网络类型:SPECIAL元件数量:3
功能数量:4端子数量:16
最高工作温度:125 °C最低工作温度:-55 °C
封装高度:0.6 mm封装长度:6.4 mm
封装形状:RECTANGULAR PACKAGE封装形式:SMT
封装宽度:1.6 mm包装方法:TR, 7 INCH
额定功率耗散 (P):0.0625 W额定温度:70 °C
电阻:165 Ω电阻器类型:ARRAY/NETWORK RESISTOR
第二/最后一个元素电阻:140 Ω尺寸代码:2506
子类别:Array/Network Resistors表面贴装:YES
温度系数:200 ppm/ °C端子面层:Tin (Sn)
端子形状:WRAPAROUND容差:1%
工作电压:5 VBase Number Matches:1

CAT16-LV4F12 数据手册

  
Features  
HIGH PERFORMANCE TERMINATION  
Controlled impedance  
RoHS compliant*  
NETWORK  
Miniaturized circuitry and packaging  
for space reduction  
Designed for gigabit communication  
networks  
CAT16-LV4F12 - Concave Chip Array  
Electrical Characteristics  
Product Dimensions  
Resistance  
R1 .............................................165 ohms  
R2 .............................................140 ohms  
Tolerance ............................................ 1 ꢀ  
TCR........................................ 200 ꢁꢁm˚C  
Temꢁerature Range .........-55 ˚C to +125 ˚C  
Max. Oꢁerating Voltage ....................5 VDC  
Max. Power Resistance................ .0625 W  
Solderability .....................>95 ꢀ Coverage  
16  
15  
14 13 12 11 10  
9
.30 ± .10  
(.012 ± .004)  
DIA.  
.45 ± .10  
(.018 ± .004)  
.60 ± .10  
(.024 ± .004)  
.40 ± .10  
(.016 ± .004)  
1.60 ± .15  
(.063 ± .060)  
.80 ± .10  
(.031 ± .004)  
.40 ± .10  
(.016 ± .004)  
6.40 ± .15  
(.253 ± .006)  
For Standard Values Used in Caꢁacitors,  
Inductors, and Resistors, click here.  
1
2
3
4
5
6
7
8
MM  
(INCHES)  
DIMENSIONS ARE:  
Packaging Specifications  
4000 pcs - per 7 " reel  
4.0 .10  
(.157 .004)  
2.00 0.20  
(.079 .008)  
2.0 .05  
(.079 .002)  
0.9 0.1  
(.035 .004)  
13 ± 0.5  
(.512 ± .020)  
DIA.  
6.9 0.2  
(.272 .008)  
60.0 ± 1.0  
(2.36 ± .039)  
5.5 0.1  
(.217 .004)  
DIA.  
12.0 0.2  
(.472 .008)  
178.0 ± 2.0  
(7.008 ± .080)  
21 ± 0.5  
(.827 ± .020)  
1.5 +.10/-0  
(.060 +.004/-0)  
4.0 .10  
(.158 .004)  
1.75 .10  
(.069 .004)  
12.5 ± 2  
(.492 ± .079)  
10.0 ± 1.5  
(.394 ± .059)  
Land Pattern  
Derating Curve  
Solder resist  
100  
80  
60  
40  
20  
0
Land  
0.7 to 0.9  
(.028 to .035)  
Chip resistor array CAT  
2.0 to 2.2  
(.079 to .087)  
-55  
0
125  
70  
(°C) Ambient temperature  
0.4 to 0.45  
(.016 to .0178)  
0.80  
(.032)  
Schematic  
16 15 14 13 12 11 10  
9
R2  
R1  
R2  
R1  
R2  
R1  
R2  
R1  
R1  
R1  
R1  
R1  
1
2
3
4
5
6
7
8
REV. 05/06  
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex.  
Specifications are subject to change without notice.  
Customers should verify actual device performance in their specific applications.  

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