2FAG-C15R

更新时间： 2024-02-16 03:20:11

品牌	Logo	应用领域
伯恩斯 - BOURNS		/
页数	文件大小	规格书
4页	245K
描述
Integrated Passive & Active Device using CSP

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技术参数
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2FAG-C15R 技术参数

是否Rohs认证：	符合	生命周期：	Obsolete
Reach Compliance Code：	unknown	ECCN代码：	EAR99
HTS代码：	8504.50.80.00	风险等级：	5.84
Is Samacsys：	N	认证：	IEC
电容：	30 µF	最大直流电阻：	120 Ω
滤波器类型：	DATA LINE FILTER	高度：	0.457 mm
JESD-609代码：	e1	长度：	3.005 mm
安装类型：	SURFACE MOUNT	功能数量：	6
最高工作温度：	85 °C	最低工作温度：	-40 °C
包装方法：	TAPE AND REEL	物理尺寸：	L3.005XB1.375XH0.457 (mm)/L0.118XB0.054XH0.018 (inch)
端子面层：	Tin/Silver/Copper (Sn/Ag/Cu)	Base Number Matches：	1

2FAG-C15R 数据手册

Features

Applications

■ Lead free versions available

■ RoHS compliant (lead free version)*

■ Bidirectional EMI filtering

■ Low capacitance per line

■ ESD protection

■ Cell phones

■ PDAs and notebooks

■ Digital cameras

■ MP3 players and GPS

■ Protects 6 data lines

2FAG-C15R - Integrated Passive & Active Device using CSP

General Information

The 2FAG-C15R device, manufactured using Thin Film on

Silicon technology, provides ESD protection and EMI

filtering for the LCD displays of portable electronic

devices such as cell phones, modems and PDAs. The

device incorporates six low pass filter channels where

each channel has a series 100 ohm resistor assuring a

minimum of -25 dB attenuation from 800 MHz to 3 GHz.

SOLDER

BUMPS

SILICON

DIE

Each internal and external port of the six channels

includes a TVS diode for ESD protection. The ESD

protection provided by the component enables a data

port to withstand a minimum 8 ꢀV Contact ꢁ 15 ꢀV Air

Discharge per the ESD test method specified in IEC

61000-4-2. The device measures 1.33 mm x 2.96 mm and

is available in a 15 bump CSP package intended to be

mounted directly onto an FR4 printed circuit board. The

CSP device meets typical thermal cycle and bend test

specifications without the use of an underfill material.

Electrical & Thermal Characteristics

Electrical Characteristics

Symbol

Minimum

Nominal

Maximum

Unit

(T_A= 25 °C unless otherwise noted)

Per Line Specification

Resistance

V_WM

V_BR

V_F

100

5.0

120

Ω

Capacitance @ 2.5 V 1 MHz

Rated Standoff Voltage

Breakdown Voltage @ 1 mA

Forward Voltage @ 10 mA

Leakage Current @ 3.3 V

6.0

-25

0.8

0.1

-30

I_R

S21

0.5

µA

Filter Attenuation @ 800 - 3000 MHz

ESD Protection: IEC 61000-4-2

Contact Discharge

Air Discharge

Thermal Characteristics

(T_A= 25 °C unless otherwise noted)

Operating Temperature Range

Storage Temperature Range

Power Dissipation Per Resistor

T_J

T_STG

P_D

-40

-55

+85

+150

100

°C

Reliable Electronic Solutions

Asia-Pacific:

Europe:

TEL +886- (0)2 25624117 • FAX +886- (0)2 25624116

TEL +41-41 768 5555 • FAX +41-41 768 5510

The Americas: TEL +1-951 781-5492 • FAX +1-951 781-5700

www.bourns.com

*RoHS Directive 2002/95/EC Jan 27 2003 including Annex

Specifications are subject to change without notice.

Customers should verify actual device performance in their specific applications.

12 3 4

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