BDX53B, BDX53C (NPN),
BDX54B, BDX54C (PNP)
Plastic Medium−Power
Complementary Silicon
Transistors
http://onsemi.com
These devices are designed for general−purpose amplifier and
low−speed switching applications.
DARLINGTON
8 AMPERE
COMPLEMENTARY SILICON
POWER TRANSISTORS
80−100 VOLTS, 65 WATTS
Features
• High DC Current Gain −
h
= 2500 (Typ) @ I = 4.0 Adc
C
FE
• Collector Emitter Sustaining Voltage − @ 100 mAdc
V
V
= 80 Vdc (Min) − BDX53B, 54B
= 100 Vdc (Min) − BDX53C, 54C
CEO(sus)
CEO(sus)
• Low Collector−Emitter Saturation Voltage −
4
V
V
= 2.0 Vdc (Max) @ I = 3.0 Adc
C
CE(sat)
= 4.0 Vdc (Max) @ I = 5.0 Adc
CE(sat)
C
• Monolithic Construction with Built−In Base−Emitter Shunt Resistors
• Pb−Free Packages are Available*
TO−220AB
CASE 221A
MAXIMUM RATINGS
STYLE 1
Rating
Symbol
Value
Unit
1
2
Collector−Emitter Voltage
V
Vdc
3
CEO
BDX53B, BDX54B
80
BDX53C, BDX54C
100
Collector−Base Voltage
V
Vdc
CB
EB
MARKING DIAGRAM
& PIN ASSIGNMENT
BDX53B, BDX54B
BDX53C, BDX54C
80
100
Emitter−Base Voltage
V
5.0
Vdc
Adc
4
Collector Current − Continuous
− Peak
I
8.0
12
C
Collector
Base Current
I
0.2
Adc
B
Total Device Dissipation @ T = 25°C
P
65
0.48
W
W/°C
C
D
Derate above 25°C
BDX5xyG
AY WW
Operating and Storage Junction
Temperature Range
T , T
J
−65 to +150
°C
stg
THERMAL CHARACTERISTICS
1
3
Base
Emitter
2
Characteristic
Symbol
Max
70
Unit
°C/W
°C/W
Collector
Thermal Resistance, Junction−to−Ambient
Thermal Resistance, Junction−to−Case
R
q
JA
R
q
JC
1.92
BDX5xy = Device Code
x = 3 or 4
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
y = B or C
= Assembly Location
A
Y
= Year
WW
G
= Work Week
= Pb−Free Package
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 6 of this data sheet.
©
Semiconductor Components Industries, LLC, 2006
1
Publication Order Number:
February, 2006 − Rev. 12
BDX53B/D