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BD91411GW-E2

更新时间： 2024-11-28 12:50:43
品牌 Logo 应用领域
罗姆 - ROHM 开关
页数 文件大小 规格书
27页 1205K
描述
Built-in OVP Micro USB Switch with USB2.0, MHLTM and Audio

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BD91411GW-E2 数据手册

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BD91411GW  
Datasheet  
Built-in OVP Micro USB Switch  
with USB2.0, MHLTM and Audio  
BD91411GW  
●General Description  
●Key Specifications  
BD91411GW is USB connector interface IC.  
It is possible to use it for the application for the mobile  
device such as smart phones and mobile phones.  
ꢀ OVP switch ON resistance:  
ꢀ Over Current Protection(OCP):  
ꢀ Regulator output voltage:  
120mΩ(Typ.)  
2.0A(Min.)  
3.3V or 4.9V  
ꢀ MHL/USB switch ON resistance:  
ꢀ MHL/USB switch ON capacitance:  
ꢀ VBAT standby current:  
5Ω(Typ.)  
6pF(Typ.)  
6µA (Typ.)  
-30℃ to +85℃  
●Features  
ꢀ Complete solution for mini/micro USB connect  
multiplexing.  
ꢀ Operating temperature range:  
ꢀ MHL/USB/UART 2paths, AUDIO 1path, Monaural  
Microphone 1path in 4 to 1 multiplexer.  
ꢀ Compatible with USB High Speed/Full Speed.  
ꢀ CECBUS to ID bypass switch.  
ꢀ Audio switch handle with negative voltage signal.  
ꢀ Microphone signal paths to VBUS or HDPR are built  
in.  
●Applications  
ꢀ Mobile-Phones・Smart-Phones  
ꢀ Tablet-PC  
ꢀ Digital still camera（DSC）  
ꢀ ID resistance support to CEA936A, Battery Charging  
Specification (BCS) ver1.2, MCPC, USB-OTG and  
MHL specification.  
●Package  
UCSP75M3  
W(Typ.) x D(Typ.) x H(Max.)  
3.00mm x 3.00mm x 0.85mm  
ꢀ Power-On Reset.  
ꢀ USB Charger detection support with BCS ver1.2  
specification.  
ꢀ Over voltage protection (OVP) up to 28V about  
VB(VBUS) input and VC(cradle) input.  
ꢀ Power multiplexer OVP input about VB and VC.  
ꢀ Internal Low Ron FET about OVP(VB and VC).  
ꢀ OTG power path switch (Output side in this power  
path support 28V protection) is built in.  
ꢀ VBUS linked LDO（4.9V or 3.3V are selectable.）  
2
ꢀ I C compatible Interface.  
●Typical Application Circuit  
UCSP75M3  
to Charger  
CAP_VC  
VOUT  
Ccapvc  
Ccapvb  
Internal Power for OTG  
CRADLE  
VC  
OTG_VIN  
CAP_VB  
USB  
Receptacle  
to MIC Amplifier  
MICOUT  
VBUS  
VB  
HDM1  
HDM2  
EARL  
HDP1  
HDP2  
EARR  
from MHL TX-  
to USB PHY  
HDML  
HDPR  
ID  
D-  
from HP Amplifier  
from MHL TX-  
to USB PHY  
D+  
from HP Amplifier  
ID  
to MHL TX/USB TRX  
CBUS  
GND  
to Charger  
Internal Power for SYSTEM IO  
Rpu  
VBAT  
VDDIO  
+
Battery  
VCCIN  
to Host  
SCL  
SDA  
RST  
INTB  
VCDET  
VBDET  
Cvccin  
Cvbref  
to Host  
from System Reset  
to Host  
to USB Transceiver  
VBREG  
to Host  
to Host  
to Host  
to Host  
to Host  
OTG_DET  
CHG_DET  
FACT_DET  
Fig.1 Typical Application Circuit  
○Product structure：Silicon monolithic integrated circuit ○This product is not designed protection against radioactive rays  
.www.rohm.com  
TSZ02201-0B2B0H300010-1-2  
12.Jul.2012 Rev.001  
© 2012 ROHM Co., Ltd. All rights reserved.  
1/24  
TSZ22111・14・001  
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