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BD3539NUV-TR

更新时间： 2024-01-15 02:08:52
品牌 Logo 应用领域
罗姆 - ROHM 光电二极管接口集成电路
页数 文件大小 规格书
12页 402K
描述
Terminator Support Circuit, PDSO8, 3 X 2 MM, 0.60 MM PITCH, ROHS COMPLIANT, VSON-8

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BD3539NUV-TR 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Active零件包装代码：SON
包装说明：HVSON,针数：8
Reach Compliance Code：compliantECCN代码：EAR99
HTS代码：8542.39.00.01风险等级：5.03
差分输出：NO接口集成电路类型：BUS TERMINATOR SUPPORT CIRCUIT
JESD-30 代码：R-PDSO-N8长度：3 mm
功能数量：1端子数量：8
最高工作温度：100 °C最低工作温度：-30 °C
封装主体材料：PLASTIC/EPOXY封装代码：HVSON
封装形状：RECTANGULAR封装形式：SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
峰值回流温度（摄氏度）：NOT SPECIFIED认证状态：Not Qualified
座面最大高度：1 mm最大供电电压：5.5 V
最小供电电压：2.7 V标称供电电压：3.3 V
表面贴装：YES温度等级：OTHER
端子形式：NO LEAD端子节距：0.5 mm
端子位置：DUAL处于峰值回流温度下的最长时间：NOT SPECIFIED
宽度：2 mmBase Number Matches：1

BD3539NUV-TR 数据手册

 浏览型号BD3539NUV-TR的Datasheet PDF文件第2页浏览型号BD3539NUV-TR的Datasheet PDF文件第3页浏览型号BD3539NUV-TR的Datasheet PDF文件第4页浏览型号BD3539NUV-TR的Datasheet PDF文件第5页浏览型号BD3539NUV-TR的Datasheet PDF文件第6页浏览型号BD3539NUV-TR的Datasheet PDF文件第7页 
High-performance Regulator IC Series for PCs  
Termination Regulators  
for DDR-SDRAMs  
BD3539HFN, BD3539FVM, BD3539NUV  
No.09030EBT03  
●Description  
BD3539HFN/FVM/NUV is a termination regulator compatible with JEDEC DDR-SDRAM, which functions as a linear power  
supply incorporating an N-channel MOSFET and provides a sink/source current capability up to 1A respectively. A built-in  
high-speed OP-AMP specially designed offers an excellent transient response. Requires 3.3 volts or 5.0 volts as a bias  
power supply to drive the N-channel MOSFET. Has an independent reference voltage input pin (VDDQ) and an  
independent feedback pin (VTTS) to maintain the accuracy in voltage required by JEDEC, and offers an excellent output  
voltage accuracy and load regulation. Also has a reference power supply output pin (VREF) for DDR-SDRAM or a memory  
controller. When EN pin turns to “Low”, VTT output becomes “Hi-Z” while VREF output is kept unchanged, compatible with  
“Self Refresh” state of DDR-SDRAM.  
●Features  
1) Incorporates a push-pull power supply for termination (VTT)  
2) Incorporates a reference voltage circuit (VREF)  
3) Incorporates an enabler  
4) Incorporates an undervoltage lockout (UVLO)  
5) Employs HSON8 package :2.9×3.0×0.6(mm) : BD3539HFN  
6) Employs MSOP8 package : 2.9×4.0×0.9(mm) : BD3539FVM  
7) Employs VSON8 package : 2.0×3.0×0.6(mm) : BD3539NUV  
8) Incorporates a thermal shutdown protector (TSD)  
9) Operates with input voltage from 2.7 to 5.5 volts  
10) Compatible with Dual Channel (DDR3)  
●Applications  
Power supply for DDR3- SDRAM  
●Absolute maximum ratings  
Parameter  
BD3539HFN  
BD3539FVM  
BD3539NUV  
Symbol  
VCC  
VEN  
VTT_IN  
VDDQ  
ITT  
Unit  
V
Input Voltage  
7*1*2  
Enable Input Voltage  
Termination Input Voltage  
VDDQ Reference Voltage  
Output Current  
7*1*2  
V
7*1*2  
V
7*1*2  
V
1
A
270.0*7  
616.1*8  
1770.5*9  
1790.8*10  
Power Dissipation1  
Power Dissipation2  
Power Dissipation3  
Power Dissipation4  
Operating Temperature Range  
Storage Temperature Range  
Pd1  
630*3  
1350*4  
1750*5  
-
437.5*6  
mW  
mW  
mW  
mW  
℃
-
-
-
Pd2  
Pd3  
Pd4  
Topr  
-30～+100  
-55～+150  
+150  
Tstg  
℃
Maximum Junction Temperature  
Tjmax  
℃
*1 Should not exceed Pd.  
*2 Instantaneous surge voltage, back electromotive force and voltage under less than 10% duty cycle.  
*3 With Ta≧25℃ when mounting a 70mm×70mm×1.6mm glass-epoxy substrate 1-layer board (copper foil density 0.2%), θja=198.4℃/W  
*4 With Ta≧25℃ when mounting a 70mm×70mm×1.6mm glass-epoxy substrate 1-layer board (copper foil density 7%), θja=92.4℃/W  
*5 With Ta≧25℃ when mounting a 70mm×70mm×1.6mm glass-epoxy substrate 1-layer board (copper foil density 65%), θja=71.4℃/W  
*6 With Ta≧25℃ (With no heat sink) θja=286℃/W  
*7 With Ta≧25℃ when mounting a 70mm×70mm×1.6mm glass-epoxy substrate board (when don’t mounted on a heat radiation board ), θja=463℃/W  
*8 With Ta≧25℃ when mounting a 70mm×70mm×1.6mm glass-epoxy substrate 1-layer board,θja=202.9℃/W  
*9 With Ta≧25℃ when mounting a 70mm×70mm×1.6mm glass-epoxy substrate 4-layers board, (copper foil area : 6.28mm2)  
which has copper foil in each layer, θja=70.6℃/W  
*10 With Ta≧25℃ when mounting a 70mm×70mm×1.6mm glass-epoxy substrate 4-layers board, (copper foil area : 5505mm2)  
which has copper foil in each layer, θja=69.8℃/W  
www.rohm.com  
© 2009 ROHM Co., Ltd. All rights reserved.  
2009.04 - Rev.B  
1/12  
1234567...12

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