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BD3530F-E2 PDF预览

BD3530F-E2

更新时间: 2024-09-26 21:15:47
品牌 Logo 应用领域
罗姆 - ROHM 光电二极管
页数 文件大小 规格书
2页 180K
描述
Regulator, 1 Output, CMOS, PDSO8,

BD3530F-E2 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:SOP, SOP8,.25Reach Compliance Code:compliant
风险等级:5.59可调性:ADJUSTABLE
JESD-30 代码:R-PDSO-G8输出次数:1
端子数量:8最高工作温度:100 °C
最低工作温度:-10 °C最大输出电流 1:3 A
最大输出电压 1:1.25 V最小输出电压 1:0.75 V
封装主体材料:PLASTIC/EPOXY封装代码:SOP
封装等效代码:SOP8,.25封装形状:RECTANGULAR
封装形式:SMALL OUTLINE包装方法:TAPE AND REEL
认证状态:Not Qualified子类别:Other Regulators
表面贴装:YES技术:CMOS
端子形式:GULL WING端子节距:1.27 mm
端子位置:DUALBase Number Matches:1

BD3530F-E2 数据手册

 浏览型号BD3530F-E2的Datasheet PDF文件第2页 
DDR-SDRAM Termination Regulator  
BD3530F  
Dimension (Unit : mm)  
Description  
BD3530F is a regulator developed as termination  
power supply of standard DDR-SDRAM that is  
used for PC.  
Industry's highest speed of transient response  
characteristic is realized. The built-in FET can sink  
and source load current of 3A(max.)  
Waveform quality when data is transferred at high  
speed can't be deteriorated.  
5.0±0.2  
8
5
1
4
0.15±0.1  
0.1  
BD3530F meets the bus line standards SSTL-2 of  
DDR-SDRAM.  
1.27  
0.4±0.1  
High-reliability can be realized for any applications  
using DDR-SDRAM.  
SOP8  
Features  
1) Built-in push-pull regulator for termination(VTT)  
2) Built-in reference voltage circuit(VREF)  
3) Built-in enable function  
4) Built-in under voltage lock out circuit  
5) Package SOP8  
6) Built-in thermal shut down circuit  
Applications  
Note personal computer, Desktop personal computer  
Absolute Maximum RatingsTa=25˚C)  
Parameter  
Input voltage  
Symbol  
VCC  
Limits  
7
Unit  
V
1  
1  
1  
2  
3  
VTT_IN  
VDDQ  
Pd1  
7
V
Termination input voltage  
VDDQ reference voltage  
Power dissipation 1  
7
V
560  
690  
mW  
mW  
˚C  
˚C  
Pd 2  
Power dissipation 2  
+
+
Topr  
-
10  
100  
Operating temperature range  
Tstg  
Storage temperature range  
1 Should not exceed Pd.  
-55  
150  
2 Reduced by 4.48mW for each increase in Ta of 1˚C over 25˚C(With no heat sink).  
3 Reduced by 5.52mW for each increase in Ta of 1˚C over 25˚C(PCB(70mm×70mm×1.6mm)glass epoxy mounting.)  

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