Datasheet > BD23B

BD23B

更新时间： 2024-12-01 08:51:15

品牌	Logo	应用领域
BEREX		/
页数	文件大小	规格书
5页	665K
描述
Dual Band 2-Way SMT Power Divider

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BD23B 数据手册

BD23B

Dual Band 2-Way SMT Power Divider

1900~2500MHz PCS, WCDMA & TD-SCDMA, WiBro

Device Features

 Typical Isolation = 25 dB

 Typical Insertion Loss = 0.4 dB

 MSL 1 moisture rating

 Lead-free/RoHS-compliant SOIC-8 Plastic Package

With exposed back side ground pad

Typical Performance¹

Product Description

Parameter

Min

Typical Max

Unit

MHz

BeRex’s Divider BD23B is designed for PCS,

WCDMA & TD-SCDMA and WiBro band with

low Insertion Loss and Isolation. This chip is

fully passivated for enhanced performance

and reliability and packaged in RoHS-

compliant with SOIC-8 surface mount pack-

age. It can be used without back side ground

soldering. (This may degrade the perform-

ance at the high frequency edge.)

Frequency Range

Insertion Loss

Isolation

1900

2500

0.4

0.8

IRL(S11)

-23

-25

0.05

0.5

-15

0.2

1.0

dBm

ORL(S22/S33)

Amplitude Balance

Phase Balance

deg

*All specifications apply to the following test conditions,

1. Device performance _ measured on BeRex E/B at 25°C, 50ohm system.

2. Insertion Loss: Above 3.0dB.

3. Back side ground _ soldered.

Applications

Absolute Maximum Ratings

Parameter

Input Power

Rating



Base station Infrastructure

1W CW dBm

-55 to +155°C

-40 to +85°C

Commercial/Industrial/Military wireless system

Storage Temperature

Operating Temperature

Operation of this device above any of these parameters may result in permanent damage.

Evaluation Board Drawing

Function Block Diagram

Pins 1,3,4,6 and 7 must be DC and RF grounded.

BeRex

● website: www.berex.com

● email: sales@berex.com

Specifications and information are subject to change and products may be discontinued without notice. BeRex is a trademark of BeRex.

Rev. C

12 3 4 5

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