BD236STU

更新时间： 2024-02-13 08:14:01

品牌	Logo	应用领域
安森美 - ONSEMI		局域网开关晶体管功率双极晶体管
页数	文件大小	规格书
4页	64K
描述
PNP外延硅晶体管

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技术参数
数据手册

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BD236STU 技术参数

是否Rohs认证：	不符合	生命周期：	Active
包装说明：	,	Reach Compliance Code：	not_compliant
风险等级：	5.72	JESD-609代码：	e0
峰值回流温度（摄氏度）：	NOT SPECIFIED	端子面层：	Tin/Lead (Sn/Pb)
处于峰值回流温度下的最长时间：	NOT SPECIFIED	Base Number Matches：	1

BD236STU 数据手册

BD237 (NPN), BD234 (PNP),

BD238 (PNP)

Preferred Devices

Plastic Medium Power

Bipolar Transistors

Designed for use in 5.0 to 10 W audio amplifiers and drivers

utilizing complementary or quasi complementary circuits.

http://onsemi.com

Features

2.0 AMPERES

POWER TRANSISTORS

25 WATTS

• DC Current Gain −

= 40 (Min) @ I = 0.15 Adc

• Epoxy Meets UL 94 V0 @ 0.125 in

• ESD Ratings: Human Body Model, 3B; >8000 V

Machine Model, C; >400 V

• Pb−Free Packages are Available*

TO−225

CASE 77

STYLE 1

MAXIMUM RATINGS

BD237

BD238

Rating

Collector−Emitter Voltage

Collector−Base Voltage

Emitter−Base Voltage

Collector Current

Symbol

BD234

Unit

Vdc

Adc

MARKING DIAGRAM

CEO

CBO

EBO

100

YWW

BD23xG

5.0

2.0

1.0

Base Current

BD23x = Device Code

= 4, 7 or 8

= Year

= Work Week

= Pb−Free Package

Total Device Dissipation

@ T = 25_C

Operating and Storage Junction

Temperature Range

T , T

–55 to +150

stg

ORDERING INFORMATION

THERMAL CHARACTERISTICS

Characteristic

Device

Package

Shipping

Symbol

Max

Unit

BD234

TO−225

500 Units / Box

Thermal Resistance, Junction−to−Case

5.0

_C/W

Maximum ratings are those values beyond which device damage can occur.

Maximum ratings applied to the device are individual stress limit values (not

normal operating conditions) and are not valid simultaneously. If these limits are

exceeded, device functional operation is not implied, damage may occur and

reliability may be affected.

BD234G

TO−225

(Pb−Free)

BD237

TO−225

500 Units / Box

BD237G

TO−225

(Pb−Free)

BD238

TO−225

500 Units / Box

BD238G

TO−225

(Pb−Free)

Preferred devices are recommended choices for future use

and best overall value.

*For additional information on our Pb−Free strategy and soldering details, please

download the ON Semiconductor Soldering and Mounting Techniques

Reference Manual, SOLDERRM/D.

Semiconductor Components Industries, LLC, 2005

Publication Order Number:

November, 2005 − Rev. 14

BD237/D

12 3 4

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