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BCV46 PDF预览

BCV46

更新时间: 2024-11-26 22:27:23
品牌 Logo 应用领域
德欧泰克 - DIOTEC /
页数 文件大小 规格书
2页 69K
描述
Surface mount Si-Epitaxial PlanarTransistors

BCV46 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:,Reach Compliance Code:compliant
风险等级:5.55最大集电极电流 (IC):0.5 A
配置:DARLINGTON最小直流电流增益 (hFE):10000
湿度敏感等级:1最高工作温度:150 °C
极性/信道类型:PNP最大功率耗散 (Abs):0.25 W
子类别:Other Transistors表面贴装:YES
Base Number Matches:1

BCV46 数据手册

 浏览型号BCV46的Datasheet PDF文件第2页 
BCV26, BCV46  
PNP  
Darlington Transistors  
PNP  
Surface mount Si-Epitaxial PlanarTransistors  
Si-Epitaxial PlanarTransistoren für die Oberflächenmontage  
Version 2004-01-20  
Power dissipation – Verlustleistung  
250 mW  
2.9±0.1  
Plastic case  
Kunststoffgehäuse  
SOT-23  
(TO-236)  
1.1  
0.4  
3
Type  
Code  
Weight approx. – Gewicht ca.  
0.01 g  
2
1
Plastic material has UL classification 94V-0  
Gehäusematerial UL94V-0 klassifiziert  
1.9  
Standard packaging taped and reeled  
Standard Lieferform gegurtet auf Rolle  
Dimensions / Maße in mm  
1 = B1 2 = E2 3 = C  
Maximum ratings (TA = 25/C)  
Grenzwerte (TA = 25/C)  
BCV26  
BCV46  
60 V  
Collector-Emitter-voltage  
VBE = 0  
E open  
C open  
- VCES  
- VCB0  
- VEB0  
Ptot  
30 V  
40 V  
Collector-Base-voltage  
80 V  
Emitter-Base-voltage  
10 V  
Power dissipation – Verlustleistung  
Collector current – Kollektorstrom (dc)  
250 mW 1)  
500 mA  
800 mA  
100 mA  
150/C  
- IC  
Peak Collector current – Kollektor-Spitzenstrom - ICM  
Base current – Basisstrom (dc)  
- IB  
Tj  
Junction temperature – Sperrschichttemperatur  
Storage temperature – Lagerungstemperatur  
TS  
- 65…+ 150/C  
Characteristics (Tj = 25/C)  
Kennwerte (Tj = 25/C)  
Min.  
Typ.  
Max.  
Collector-Base cutoff current – Kollektorreststrom  
IE = 0, - VCB = 30 V  
IE = 0, - VCB = 60 V  
BCV26  
BCV46  
- ICB0  
- ICB0  
100 nA  
100 nA  
Emitter-Base cutoff current – Emitterreststrom  
IC = 0, - VEB = 10 V  
Collector saturation volt. – Kollektor-Sättigungsspg. 2)  
- IEB0  
100 nA  
1 V  
- IC = 100 mA, - IB = 0.1 mA  
- VCEsat  
1
2
)
)
Mounted on P.C. board with 3 mm2 copper pad at each terminal  
Montage auf Leiterplatte mit 3 mm2 Kupferbelag (Lötpad) an jedem Anschluß  
Tested with pulses tp = 300 :s, duty cycle # 2% – Gemessen mit Impulsen tp = 300 :s, Schaltverhältnis # 2%  
6

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