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BCM8727 PDF预览

BCM8727

更新时间: 2024-09-25 12:36:23
品牌 Logo 应用领域
博通 - BOARDCOM 电信集成电路
页数 文件大小 规格书
2页 129K
描述
DUAL-CHANNEL 10-GBE SFI-TO-XAUI™ TRANSCEIVER WITH EDC

BCM8727 技术参数

生命周期:Active零件包装代码:BGA
包装说明:BGA,针数:324
Reach Compliance Code:compliantHTS代码:8542.39.00.01
风险等级:5.2JESD-30 代码:S-PBGA-B324
功能数量:1端子数量:324
封装主体材料:PLASTIC/EPOXY封装代码:BGA
封装形状:SQUARE封装形式:GRID ARRAY
认证状态:Not Qualified标称供电电压:1 V
表面贴装:YES电信集成电路类型:TELECOM CIRCUIT
端子形式:BALL端子位置:BOTTOM
Base Number Matches:1

BCM8727 数据手册

 浏览型号BCM8727的Datasheet PDF文件第2页 
BCM8727  
®
Brief  
DUAL-CHANNEL 10-GBE SFI-TO-XAUI™ TRANSCEIVER WITH EDC  
S U M M A R Y O F B E N E F I T S  
F E A T U R E S  
Dual-channel SFI-to-XAUI™ transceiver  
Single-reference clock input enables use of low-cost 156.25  
MHz oscillator.  
Integrated microcontroller and AGC with a wide dynamic  
range  
Supports low-cost SFP+ copper twin-ax up to 15m  
Supports SFP+ SR, LR, and LRM optical interfaces and up to  
15m of direct attached copper  
LRM mode supports 300m of Multimode Fiber (MMF),  
exceeding the IEEE 802.3aq standard.  
Programmable amplitude control on 10G serial transmitter  
interface  
PMD transmit preemphasis for flexible placement of Physical  
Layer (PHY)  
Standard two-wire Broadcom Serial Interface (BSC) support  
for external E2, XFP, SFP, SFP+  
Support for module present detection and configuring of  
BCM8727 accordingly  
MDIO interface compliant to IEEE802.3ae Clause 45 with  
extended indirect address register access  
Multirate 10 GbE and 1 GbE support for legacy interfaces  
Support for XFP/XFI interfaces  
A P P L I C A T I O N S  
Physical Medium Dependent (PMD) interface: serial 10.3125  
Gbps CML  
High-density Ethernet Switching and Routing Platforms  
Next-generation Blade Servers  
PCS 64B/66B scrambler/descrambler  
XGXS 8B/10B error detection ENDEC  
XAUI link synchronization/deskew  
SFP+ optical SR, LR, and LRM modules  
SFP+ copper twin-ax  
4-lane XAUI interface (3.125 Gbps)  
Built-In Self-Test (BIST) on 10G serial and XAUI interfaces  
Power dissipation: 2.4W  
Core supply—1.0V, I/O—3.3V  
Small 19 mm x 19 mm BGA package, 1-mm ball pitch  
BCM8727 Functional Block Diagram  
BCM8727  
10.3125  
Gbps  
SFI 1  
SFP+  
SFP+  
XAUI Interface 1  
XAUI Interface 2  
LRM-  
EDC  
MAC/  
Switch  
10.3125  
Gbps  
SFI 2  
LRM-  
EDC  
MDC MDIO  
Management  
Interface  

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