Datasheet > BCM400P500T1K8A31

BCM400P500T1K8A31

更新时间： 2024-11-19 22:04:19

品牌	Logo	应用领域
VICOR		/
页数	文件大小	规格书
23页	2941K
描述
380VIN BCM BUS CONV 48VOUT 1750W

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BCM400P500T1K8A31 数据手册

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BCM^®Bus Converter

BCM400y500x1K8A31

NRTL US

Fixed Ratio DC-DC Converter

Features

Product Ratings

• Up to 1750 W continuous output power

• 2735 W/in³power density

V_IN= 400 V (260 – 410 V)

POUT = up to 1750 W

K = 1/8

• 98.0% peak efficiency

V_OUT= 50 V (32.5 – 51.3 V)

• 4242 Vdc isolation

(NO LOAD)

• Parallel operation for multi-kW arrays

• OV, OC, UV, short circuit and thermal protection

• 6123 through-hole ChiP package

n2.494” x 0.898” x 0.286”

Product Description

The VI Chip® Bus Converter (BCM) is a high eﬃciency Sine

Amplitude Converter (SAC), operating from a 260 to 410 VDC

primary bus to deliver an isolated ratiometric output from

32.5 to 51.3 VDC.

(63.34 mm x 22.80 mm x 7.26 mm)

• PMBus^TMmanagement interface*

The BCM400y500x1K8A31 oﬀers low noise, fast transient

response, and industry leading eﬃciency and power density. In

addition, it provides an AC impedance beyond the bandwidth

of most downstream regulators, allowing input capacitance

normally located at the input of a POL regulator to be located at

the input of the BCM module. With a K factor of 1/8, that

capacitance value can be reduced by a factor of 64x, resulting

in savings of board area, material and total system cost.

Typical Applications

• 380 DC Power Distribution

• High End Computing Systems

• Automated Test Equipment

• Industrial Systems

The BCM400y500x1K8A31, combined with the D44TL1A0

Digital Supervisor and I13TL1A0 Digital Isolator, provide a

secondary referenced PMBus™ compatible telemetry and

control interface. This interface provides access to the BCM’s

internal controller conﬁguration, fault monitoring, and other

telemetry functions.

• High Density Power Supplies

• Communications Systems

• Transportation

Leveraging the thermal and density beneﬁts of Vicor’s ChiP

packaging technology, the BCM module oﬀers ﬂexible thermal

management options with very low top and bottom side

thermal impedances. Thermally-adept ChiP-based power

components, enable customers to achieve low cost power

system solutions with previously unattainable system size,

weight and eﬃciency attributes, quickly and predictably.

*When used with D44TL1A0 and I13TL1A0 chipset

BCM^®Bus Converter

Page 1 of 23

Rev 1.3

05/2015

vicorpower.com

800 927.9474

12 3 4 5 6 7...23

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