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BC857BS-7 PDF预览

BC857BS-7

更新时间: 2024-02-09 22:47:48
品牌 Logo 应用领域
美台 - DIODES 晶体小信号双极晶体管开关光电二极管PC
页数 文件大小 规格书
3页 107K
描述
Small Signal Bipolar Transistor, 0.1A I(C), 45V V(BR)CEO, 2-Element, PNP, Silicon, ULTRA SMALL, PLASTIC PACKAGE-6

BC857BS-7 技术参数

是否无铅:不含铅是否Rohs认证:符合
生命周期:Active包装说明:SMALL OUTLINE, R-PDSO-G6
针数:6Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8541.21.00.95
Factory Lead Time:15 weeks风险等级:0.84
Samacsys Confidence:3Samacsys Status:Released
Samacsys PartID:440701Samacsys Pin Count:6
Samacsys Part Category:Undefined or MiscellaneousSamacsys Package Category:SOT23 (6-Pin)
Samacsys Footprint Name:SOT363_1Samacsys Released Date:2017-01-11 16:09:24
Is Samacsys:N最大集电极电流 (IC):0.1 A
集电极-发射极最大电压:45 V配置:SEPARATE, 2 ELEMENTS
最小直流电流增益 (hFE):220JESD-30 代码:R-PDSO-G6
JESD-609代码:e3湿度敏感等级:1
元件数量:2端子数量:6
最高工作温度:125 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):260极性/信道类型:PNP
最大功率耗散 (Abs):0.2 W认证状态:Not Qualified
子类别:Other Transistors表面贴装:YES
端子面层:Matte Tin (Sn)端子形式:GULL WING
端子位置:DUAL处于峰值回流温度下的最长时间:40
晶体管应用:SWITCHING晶体管元件材料:SILICON
标称过渡频率 (fT):100 MHzBase Number Matches:1

BC857BS-7 数据手册

 浏览型号BC857BS-7的Datasheet PDF文件第2页浏览型号BC857BS-7的Datasheet PDF文件第3页 
BC857BS  
DUAL PNP SURFACE MOUNT SMALL SIGNAL TRANSISTOR  
Features  
Ideally Suited for Automated Insertion  
SOT-363  
Min  
A
For Switching and AF Amplifier Applications  
Ultra-Small Surface Mount Package  
Lead Free/RoHS Compliant (Note 2)  
"Green" Device (Note 4 and 5)  
Dim  
A
B
C
D
F
Max  
0.30  
1.35  
2.20  
0.10  
C
B
1.15  
2.00  
Mechanical Data  
0.65 Nominal  
Case: SOT-363  
Case Material: Molded Plastic. UL Flammability  
Classification Rating 94V-0  
Moisture Sensitivity: Level 1 per J-STD-020C  
Terminals: Solderable per MIL-STD-202, Method 208  
Lead Free Plating (Matte Tin Finish annealed over Alloy  
42 leadframe).  
Terminal Connections: See Diagram  
Marking: K3W (See Page 3)  
Ordering Information (See Page 3)  
Weight: 0.006 grams  
H
0.30  
1.80  
0.40  
2.20  
0.10  
1.00  
0.40  
0.25  
8°  
K
J
M
H
J
L
D
K
L
0.90  
0.25  
0.10  
0°  
F
C2  
E1  
B1  
M
α
All Dimensions in mm  
B2  
C1  
E2  
TOP VIEW  
Maximum Ratings @TA = 25°C unless otherwise specified  
Characteristic  
Collector-Base Voltage  
Symbol  
VCBO  
VCEO  
VEBO  
IC  
ICM  
IBM  
Pd  
Value  
-50  
Unit  
V
-45  
V
Collector-Emitter Voltage  
Emitter-Base Voltage  
Collector Current  
Peak Collector Current  
Peak Base Current  
-5.0  
-100  
-200  
-200  
200  
V
(Note 1)  
(Note 1)  
(Note 1)  
(Note 1)  
mA  
mA  
mA  
mW  
Power Dissipation at TSB = 50°C  
Operating and Storage Temperature Range  
-55 to +125  
°C  
Tj, TSTG  
Electrical Characteristics @TA = 25°C unless otherwise specified  
Characteristic  
Symbol  
hFE  
Min  
220  
Typ  
Max  
475  
625  
Unit  
Test Condition  
VCE = -5.0V, IC = -2.0mA  
DC Current Gain  
(Note 3)  
(Note 1)  
Thermal Resistance, Junction to Ambient Air  
°C/W Note 1  
Rθ  
JA  
IC = -10mA, IB = -0.5mA  
IC = -100mA, IB = -5.0mA  
IC = -10mA, IB = -0.5mA  
VCE = -5.0V, IC = -2.0mA  
VCB = -30V, IE = 0  
VCB = -30V, Tj = 150°C  
VEB = -5.0V, IC = 0  
VCE = -5.0V, IC = -10mA,  
f = 100MHz  
-100  
-400  
Collector-Emitter Saturation Voltage  
(Note 3)  
mV  
VCE(SAT)  
Base-Emitter Saturation Voltage  
Base-Emitter Voltage  
(Note 3)  
(Note 3)  
-580  
-700  
-665  
-750  
mV  
mV  
VBE(SAT)  
VBE  
ICBO  
ICBO  
IEBO  
-15  
-4.0  
nA  
µA  
Collector Cutoff Current  
Emitter Cutoff Current  
Gain Bandwidth Product  
-100  
nA  
100  
MHz  
fT  
Collector-Base Capacitance  
Emitter-Base Capacitance  
11  
3
pF  
pF  
CCBO  
CEBO  
VCB = -10V, f = 1.0MHz  
VEB = -0.5V, f = 1.0MHz  
Notes:  
1. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which  
can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.  
2. No purposefully added lead.  
3. Short duration pulse test used to minimize self-heating effect.  
4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.  
5. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date  
Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.  
DS30373 Rev. 6 - 2  
1 of 3  
BC857BS  
© Diodes Incorporated  
www.diodes.com  

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