BC847CDLP
NPN DUAL SURFACE MOUNT TRANSISTOR
Features
•
•
•
•
•
Epitaxial Planar Die Construction
B
E
DFN1310H4-6
Min Max
Ideally Suited for Automated Assembly Processes
Lead Free By Design/RoHS Compliant (Note 1)
"Green" Device (Note 2)
C
Dim
A
Typ
C
1.25 1.38 1.30
0.95 1.08 1.00
0.20 0.30 0.25
B
E
Ultra Low Profile Package
B
Top View
Mechanical Data
C
G
H
•
•
Case: DFN1310H4-6
D*
E**
G
-
-
-
-
0.10
0.20
-
Case Material: Molded Plastic, “Green” Molding
Compound. UL Flammability Classification Rating
94V-0
Moisture Sensitivity: Level 1 per J-STD-020C
Terminals: Finish ⎯ NiPdAu annealed over Copper
leadframe (Lead Free Plating). Solderable per MIL-
Side View
-
0.40
•
•
K
L
Z
H
0
0.05 0.02
K*
L*
0.10 0.20 0.15
0.30 0.50 0.40
STD-202, Method 208
B
B
E
C
E
C
L
•
•
•
Marking Code Information: See Page 4
Ordering Information: See Page 4
Weight: 0.0015g (approximate)
B
N
C
M**
N*
Z**
-
-
-
-
-
-
0.35
0.25
0.05
D
Z
E
M
D
N
Internal Schematic
(TOP VIEW)
All Dimensions in mm
A
* Dimensions D, K, L, N Repeat 4X
** Dimensions E, M, Z Repeat 2X
Bottom View
Maximum Ratings @TA = 25°C unless otherwise specified
Characteristic
Collector-Base Voltage
Symbol
VCBO
VCEO
VEBO
IC
Value
50
Unit
V
Collector-Emitter Voltage
Emitter-Base Voltage
45
V
6.0
V
Collector Current
100
350
mA
mW
Power Dissipation (Note 3)
Pd
Thermal Resistance, Junction to Ambient (Note 3)
Operating and Storage Temperature Range
357
°C/W
°C
RθJA
-65 to +150
T , TSTG
j
Notes:
1. No purposefully added lead.
2. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
3. Device mounted on FR-4 PCB pad layout as shown on page 4.
4. Radiused pad feature is intended for device manufacturing control and should not be considered as a polarity indicator, or to suggest orientation of
the devices in the carrier tape.
DS30817 Rev. 6 - 2
1 of 4
BC847CDLP
© Diodes Incorporated
www.diodes.com