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BC637_11 PDF预览

BC637_11

更新时间: 2024-09-25 08:49:39
品牌 Logo 应用领域
安森美 - ONSEMI 晶体晶体管
页数 文件大小 规格书
4页 89K
描述
High Current Transistors

BC637_11 数据手册

 浏览型号BC637_11的Datasheet PDF文件第2页浏览型号BC637_11的Datasheet PDF文件第3页浏览型号BC637_11的Datasheet PDF文件第4页 
BC637, BC639, BC639-16  
High Current Transistors  
NPN Silicon  
Features  
These are PbFree Devices*  
http://onsemi.com  
COLLECTOR  
2
MAXIMUM RATINGS  
3
Rating  
Symbol  
Value  
Unit  
BASE  
Collector - Emitter Voltage  
V
V
V
Vdc  
CEO  
CBO  
EBO  
BC637  
BC639  
60  
80  
1
EMITTER  
Collector - Base Voltage  
Vdc  
BC637  
BC639  
60  
80  
Emitter - Base Voltage  
5.0  
1.0  
Vdc  
Adc  
Collector Current Continuous  
I
C
TO92  
CASE 29  
STYLE 14  
Total Device Dissipation @ T = 25°C  
P
D
625  
5.0  
mW  
mW/°C  
A
Derate above 25°C  
Total Device Dissipation @ T = 25°C  
P
800  
12  
mW  
C
D
1
Derate above 25°C  
mW/°C  
1
2
2
3
3
Operating and Storage Junction  
Temperature Range  
T , T  
J
55 to +150  
°C  
stg  
STRAIGHT LEAD  
BULK PACK  
BENT LEAD  
TAPE & REEL  
AMMO PACK  
THERMAL CHARACTERISTICS  
Characteristic  
Symbol  
Max  
200  
Unit  
°C/W  
°C/W  
Thermal Resistance, JunctiontoAmbient  
Thermal Resistance, JunctiontoCase  
R
q
JA  
MARKING DIAGRAMS  
R
83.3  
q
JC  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
BC  
63x  
BC63  
916  
AYWW G  
G
AYWW G  
G
x
A
Y
= 7 or 9  
= Assembly Location  
= Year  
WW = Work Week  
G
= PbFree Package  
(Note: Microdot may be in either location)  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 2 of this data sheet.  
*For additional information on our PbFree strategy and soldering details, please  
download the ON Semiconductor Soldering and Mounting Techniques  
Reference Manual, SOLDERRM/D.  
© Semiconductor Components Industries, LLC, 2011  
1
Publication Order Number:  
February, 2011 Rev. 1  
BC637/D  

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