M C C
BAV300
THRU
BAV303
ꢀꢁꢂꢃꢄꢅꢆꢄꢇꢇꢈꢃꢂꢁꢉꢊꢅꢆomponents
20736 Marilla Street Chatsworth
ꢆꢋꢅꢌꢍꢎꢍꢍ
ꢏꢐꢄꢑꢈꢒꢅꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢎ
$ꢉ%ꢒꢅ ꢅ ꢅ ꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢌ
TM
Micro Commercial Components
Features
•
•
•
•
•
Saving Space
Silicon Epitaxial Planar Diodes
Hermetic Sealed Parts
Fits onto SOD-323/SOT-23 footprints
Switching Diodes
Electrical data identical with the devices BAV100…BAV103
Maximum Ratings
MICROMELF
Continuous Reverse
Voltage
BAV300
BAV301
BAV302
BAV303
50V
TA=25℃
TA=25℃
100V
150V
200V
VR
Cathode Mark
Repetitive Peak Reverse
Voltage
BAV300
60V
BAV301
BAV302
BAV303
120V
200V
250V
VRRM
C
TA=25℃
Forward DC Current
250mA
625mA
1.0A
IF
Repetitive Peak Forward
Current
f=50Hz, TA=25℃
TP=1s, Tj=25℃
Note (1)
IFRM
IFSM
RthJA
B
Surge Forward Current
Thermal Resistance
Junction to Ambient
A
500K/W
175℃
Junction temperature
Tj
-65 to + 175℃
Storage temperature Range
Tstg
Note: (1) mounted on epoxy-glass hard tissue, Fig.4 35μm copper clad, 0.9 mm2
copper area per electrode
DIMENSIONS
Electrical Characteristics @ 25°C Unless Otherwise Specified
INCHES
MIN
MM
Maximum Forward Voltage
DIM
A
MAX
.079
.008
.051
MIN
1.8
MAX
2.0
NOTE
IF = 100mA ,TA=25℃
VF
1.00V
.071
.004
.047
B
C
.10
1.20
.20
1.30
Maximum Leakage current
BAV300
100nA
15μA
100nA
15μA
100nA
15μA
100nA
15μA
VR=50V
VR=50V, Tj=100℃
VR=100V
Æ
BAV300
BAV301
BAV301
BAV302
BAV302
BAV303
BAV303
VR=100V, Tj=100℃
IR
VR=150V
VR=150V, Tj=100℃
VR=200V
SUGGESTED SOLDER
PAD LAYOUT
VR=200V, Tj=100℃
0.039
Maximum Leakage current
BAV300
BAV301
BAV302
BAV303
60V
120V
200V
250V
IR=100μA, t
P/T=0.01,
tP=0.3ms
V(BR)
0.055”
Diode Capacitance
CD
trr
1.5pF
50ns
VR=0V, f=1.0MHz
Maximum Reverse recovery
time
IF=10mA, IR=30mA
Irr=3.0mA, RL=100Ω
0.030”
Differential Forward
Resistance
rF
5.0 Ω
IF=10mA
www.mccsemi.com
Revision: 3
2006/05/28
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