BAT54TW /ADW /
CDW /SDW /BRW
SURFACE MOUNT SCHOTTKY BARRIER DIODE ARRAYS
Features
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Low Forward Voltage Drop
Fast Switching
Ultra-Small Surface Mount Package
PN Junction Guard Ring for Transient and ESD Protection
Lead Free/RoHS Compliant (Note 2)
"Green" Device (Note 3 and 4)
SOT-363
Dim
A
B
C
D
F
Min
0.10
1.15
2.00
Max
0.30
1.35
2.20
A
C
B
TOP VIEW
0.65 Nominal
Mechanical Data
0.30
1.80
⎯
0.40
2.20
0.10
1.00
0.40
0.25
8°
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Case: SOT-363
Case Material: Molded Plastic. UL Flammability
Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020C
Terminals: Solderable per MIL-STD-202, Method 208
Lead Free Plating (Matte Tin Finish annealed over Alloy
42 leadframe). Please See Ordering Information, Note 6,
on Page 3
Orientation: See Diagrams Below
Marking Information: See Diagrams Below & Page 3
Weight: 0.006 grams (approximate)
H
J
H
K
L
0.90
0.25
0.10
0°
K
J
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M
M
α
L
D
F
All Dimensions in mm
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AC
1
AC
1
C2
C3
C1
C1
C2
A2
A2
C2
C2
C1
A2
A1
C2
AC
2
A1
A2
A3
AC
A2
A1
C2
A1
A1
A1
C1
2
A2
C1
C1
BAT54TW
Marking: KLA
BAT54BRW
Marking: KLB
BAT54ADW*
Marking: KL6
BAT54SDW*
Marking: KL8
BAT54CDW*
Marking: KL7
*Symmetrical configuration, no orientation indicator.
Maximum Ratings @TA = 25°C unless otherwise specified
Characteristic
Symbol
Value
Unit
VRRM
VRWM
VR
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
30
V
Forward Continuous Current
Repetitive Peak Forward Current
Forward Surge Current
(Note 1)
(Note 1)
200
300
mA
mA
IF
IFRM
IFSM
Pd
(Note 1)
@ t < 1.0s
(Note 1)
600
mA
Power Dissipation
200
mW
°C/W
°C
Thermal Resistance, Junction to Ambient Air
Operating and Storage Temperature Range
(Note 1)
625
Rθ
JA
-65 to +125
Tj, TSTG
Notes:
1. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which
can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. No purposefully added lead.
3. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
4. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
DS30152 Rev. 14 - 2
1 of 3
BAT54TW /ADW /CDW /SDW /BRW
© Diodes Incorporated
www.diodes.com