Datasheet > BAT54JW_08

BAT54JW_08

更新时间： 2024-11-09 08:48:47

品牌	Logo	应用领域
美台 - DIODES		肖特基二极管
页数	文件大小	规格书
3页	116K
描述
SURFACE MOUNT SCHOTTKY BARRIER DIODE ARRAY

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中文翻译

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数据手册

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BAT54JW_08 数据手册

BAT54JW

SURFACE MOUNT SCHOTTKY BARRIER DIODE ARRAY

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Features

Mechanical Data

•

Low Forward Voltage Drop

Fast Switching

Ultra-Small Surface Mount Package

PN Junction Guard Ring for Transient and ESD Protection

Lead Free/RoHS Compliant (Note 3)

"Green" Device (Note 4 and 5)

•

Case: SOT-363

Case Material: Molded Plastic. UL Flammability Classification

Rating 94V-0

Moisture Sensitivity: Level 1 per J-STD-020D

Terminals: Solderable per MIL-STD-202, Method 208

•

Lead Free Plating (Matte Tin Finish annealed over Alloy 42

leadframe).

•

Orientation: See Diagram

Marking Information: See Page 3

Ordering Information: See Page 3

Weight: 0.006 grams (approximate)

C₂

C₁

(Jumper

connection

between

middle pins)

A₁

A₂

Top View

Device Schematic

Maximum Ratings @T = 25°C unless otherwise specified

Characteristic

Symbol

Value

Unit

V_RRM

V_RWM

V_R

Peak Repetitive Reverse Voltage

Working Peak Reverse Voltage

DC Blocking Voltage

Forward Continuous Current

Repetitive Peak Forward Current

Forward Surge Current

(Note 1)

200

300

600

I_F

I_FRM

I_FSM

(Note 1)

@ t < 1.0s

Thermal Characteristics

Characteristic

Symbol

Value

200

Unit

Power Dissipation

(Note 1)

P_D

Thermal Resistance, Junction to Ambient Air

Operating and Storage Temperature Range

625

°C/W

°C

R_θ

-65 to +125

T_J, T_STG

Electrical Characteristics @T = 25°C unless otherwise specified

Characteristic

Reverse Breakdown Voltage

Symbol

Min

Typ

Max

Unit

Test Condition

(Note 2)

V_(BR)R

⎯

I_R= 100μA

I_F= 0.1mA

I_F= 1mA

I_F= 10mA

I_F= 30mA

I_F= 100mA

240

320

400

500

1000

Forward Voltage

⎯

V_F

Reverse Leakage Current

Total Capacitance

(Note 2)

2.0

I_R

⎯

μA

V_R= 25V

C_T

V_R= 1.0V, f = 1.0MHz

I_F= 10mA through I_R= 10mA

to I_R= 1.0mA, R_L= 100Ω

Reverse Recovery Time

5.0

t_rr

⎯

Notes:

1. Device mounted on FR-4 PC board with recommended pad layout, which can be found on our website at

http://www.diodes.com/datasheets/ap02001.pdf.

2. Short duration pulse test used to minimize self-heating effect.

3. No purposefully added lead.

4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.

5. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date

Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.

1 of 3

www.diodes.com

July 2008

BAT54JW

Document number: DS30157 Rev. 11 - 2

12 3

中文翻译

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