BAT54TW /ADW /
CDW /SDW /BRW
SURFACE MOUNT SCHOTTKY BARRIER DIODE ARRAYS
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Features
Mechanical Data
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Low Forward Voltage Drop
Fast Switching
Ultra-Small Surface Mount Package
PN Junction Guard Ring for Transient and ESD Protection
Lead Free/RoHS Compliant (Note 2)
"Green" Device (Note 3 and 4)
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Case: SOT-363
Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020D
Terminals: Solderable per MIL-STD-202, Method 208
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Lead Free Plating (Matte Tin Finish annealed over Alloy 42
leadframe).
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Orientation: See Diagrams Below
Marking Information: See Page 3
Ordering Information: See Page 2
Weight: 0.006 grams (approximate)
AC
1
AC
1
C2
A2
A2
C2
C3
A1
C2
C1
A2
C2
C1
C1
C2
AC
2
AC
2
A1
A2
A3
A2
C2
C1
A1
A1
A1
C1
A2
C1
A1
Top View
BAT54ADW*
BAT54CDW*
BAT54SDW*
BAT54BRW
BAT54TW
*Symmetrical configuration, no orientation indicator.
Maximum Ratings @T = 25°C unless otherwise specified
A
Characteristic
Symbol
VRRM
VRWM
VR
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
30
V
Forward Continuous Current (Note 1)
200
300
600
mA
mA
mA
IF
Repetitive Peak Forward Current (Note 1)
IFRM
IFSM
Forward Surge Current (Note 1)
@ t < 1.0s
Thermal Characteristics
Characteristic
Power Dissipation (Note 1)
Symbol
PD
Value
200
Unit
mW
Thermal Resistance, Junction to Ambient Air (Note 1)
Operating and Storage Temperature Range
625
°C/W
Rθ
TJ, TSTG
JA
-65 to +125
°C
Electrical Characteristics @T = 25°C unless otherwise specified
A
Characteristic
Symbol
Min
Typ
Max
Unit
Test Condition
Reverse Breakdown Voltage (Note 5)
30
V
V(BR)R
⎯
⎯
IR = 100μA
IF = 0.1mA
IF = 1mA
240
320
Forward Voltage (Note 5)
400
500
1000
mV
⎯
⎯
IF = 10mA
IF = 30mA
IF = 100mA
VF
Reverse Leakage Current (Note 5)
Total Capacitance
2.0
10
IR
⎯
⎯
⎯
⎯
μA
VR = 25V
pF
CT
VR = 1.0V, f = 1.0MHz
IF = 10mA through IR = 10mA
to IR = 1.0mA, RL = 100Ω
Reverse Recovery Time
5.0
ns
trr
⎯
⎯
Notes:
1. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which
can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. No purposefully added lead.
3. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
4. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants
5. Short duration pulse test used to minimize self-heating effect.
1 of 3
www.diodes.com
July 2008
© Diodes Incorporated
BAT54TW /ADW /CDW /SDW /BRW
Document number: DS30152 Rev. 16 - 2